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All CFPs on WikiCFP | ||||||||||||||||||||||||||||||||||||||||||||||
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Present CFP : 2015 | ||||||||||||||||||||||||||||||||||||||||||||||
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CALL FOR PAPERS IEEE ICESS-2015 12th IEEE International Conference on Embedded Software and Systems http://cse.stfx.ca/~icess2015/index.html August 24-26, 2015, New York, USA *********************************************************************************** IMPORTANT DATES Abstract submission: April 3, 2015 Paper submission: April 30, 2015 Acceptance notification: June 15, 2015 Camera-ready papers: July 15, 2015 Conference Date: August 24-26, 2015 SCOPE The ICESS-2015 conference is the 12th IEEE International Conference on Embedded Software and Systems. It provides an international forum for presenting and discussing emerging ideas and trends in embedded software and systems from both the research community as well as the industry. ICESS-2015 is sponsored by IEEE, IEEE Computer Society, and IEEE Technical Committee on Scalable Computing (TCSC). TOPIC OF INTEREST Track I: Systems, Models and Algorithms Embedded System Architecture Embedded Software Architectures Embedded OS, Scheduling and Runtime Support Embedded Storage and I/O Systems Real-Time Embedded Systems Distributed and Networked Embedded Systems Fault Tolerant and Trusted Embedded Systems Mixed-Critical Embedded Systems Heterogeneous SoC and Multicore Embedded Systems Power and Thermal Aware Computing Pervasive/Ubiquitous Computing Reconfigurable Embedded Computing Track II: Design Methodology and Tools Design Technologies of Embedded Systems Formal Methods for Embedded Systems Middleware for Embedded Systems IDE and Software Tools Hardware/Software Co-Design Component-Based Embedded Software Design Model-based Design for Embedded Software Domain/Application-Specific Design Techniques Testing Techniques for Embedded Software/Systems Verification and Validation for Embedded Systems Compilation and Debug Techniques and Tools Performance Evaluation Techniques and Tools Track III: Emerging Embedded Applications and Interdisciplinary Topics Intelligent Embedded Systems Robotics and Control Systems Wireless Sensor Networks (WSN) Cyber-Physical Systems Embedded Automotive, Medical and Avionics Systems Embedded Database & Multimedia Systems QoS Support for Embedded Systems Embedded Network Protocol and Security Emergency and Disaster Management Consumer Electronics Mobile Cloud Computing Industrial Practices and Case Studies PAPER SUBMISSION AND PUBLICATION Successful submissions should contain significant novel ideas and technical results, which have not been published or concurrently submitted to any other venue. Submitted manuscripts should be written in English conforming to the IEEE conference proceedings format (8.5" x 11", Two-Column, template available at http://www.computer.org/portal/web/cscps/formatting). Manuscripts should not exceed 8 pages, including tables, figures and references. All paper submissions must represent original and unpublished work. Papers must be submitted electronically in PDF format through EasyChair. The accepted papers from this conference will be published by IEEE Computer Society in IEEE proceedings (indexed by EI Compendex). Distinguished papers, after further revisions, will be considered for possible publication in several SCI & EI indexed special issues of prestigious international journals. By submitting a paper to the conference, authors assure that if the paper is accepted, at least one author will attend the conference and present the paper. *********************************************************************************** ORGANIZING COMMITTEE Publicity Co-Chairs Weichen Liu, Chongqing University, China Geoffrey Nelissen, Instituto Superior de Engenharia do Porto, Portugal Ying Lu, University of Nebraska - Lincoln, USA Publication Chair Tam Chantem, Utah State University, USA Workshop Chair Chun Jason Xue, City University of Hong Kong, Hong Kong Steering Committee Co-Chairs Zhaohui Wu, Zhejiang University, China Laurence T. Yang, St. Francis Xavier University, Canada General Chairs Meikang Qiu, Pace University, USA General Co-Chairs Sun-Yuan Kung, Princeton University, USA Jack Dongarra, University of Tennessee, Knoxville, USA Program Chairs Dakai Zhu, University of Texas at San Antonio, USA Samarjit Chakraborty, Technical University Of Munich, Germany Track Chairs Systems, Models and Algorithms Dakai Zhu, University of Texas at San Antonio, USA Design Methodology and Tools Dionisio de Niz, Carnegie Mellon University, USA Qi Zhu, University of California, Riverside, USA Emerging Embedded Applications and Interdisciplinary Song Han, University of Connecticut, USA Christian Poellabauer, University of Notre Dame, USA Technical Program Committee Track 1: Systems, Models and Algorithms (SMA) Bjorn A. Andersson, Carnegie Mellon University, USA Albert M. K. Cheng, University of Houston, USA Alireza Ejlali, Sharif University of Technology, Iran Nathan Fisher, Wayne State University, USA Marisol García-Valls, Universidad Carlos III de Madrid, Spain Luis Gomes, UUniversidade Nova Lisboa / UNINOVA, Portugal Nan Guan, Northeastern University, China Yifeng Guo, Netapps Inc. USA Shih-Hao Hung, National Taiwan University, Taiwan Kyoung-Don Kang, SUNY Binghamton, USA Chin-Fu Kuo, National University of Kaohsiung, Taiwan Haohan Li, The MathWorks, USA Cong Liu, University of Texas at Dallas, USA Weichen Liu, Chongqing University, China Ying Lu, University of Nebraska - Lincoln, USA Mingsong Lv, ortheastern University, China Geoffrey Nelissen, Instituto Superior de Engenharia do Porto, Portugal Gang Quan, Florida International University, USA Harini Ramaprasad, University of North Carolina at Charlotte, USA Shangping Ren, Illinois Institute of Technology, USA Zili Shao, The Hong Kong Polytechnic University, Hong Kong Hiroyuki Tomiyama, Ritsumeikan University, Japan Qi Xuan, Oracle Inc. USA Track 2: Design Methodology and Tools (DMT) Manuel E. Acacio, University of Murcia, Spain Jian-Jia Chen, Technical University of Dortmund, Germany Qingxu Deng, Northeastern University, China Marco Di Natale, Scuola Superiore Sant'Anna, Italy Petru Eles, Linköping University, Sweden Aniruddha Gokhale, Vanderbilt University, USA Sathish Gopalakrishnan, University of British Columbia, Canada Zonghua Gu, Zhejiang University, China Michael Gonzalez Harbour, Universidad de Catambria, Spain Houcine Hassan, Universitat Politecnica de Valencia, Spain Pablo Ibez-Marn, Universidad de Zaragoza, Spain Seon Kim, Korea University, Korea Jihong Kim, Seoul National University, Korea Wenchao Li, SRI International, USA Chung-Wei Lin, University of California, Berkeley, USA Alberto Macii, Politecnico di Torino, Italy Sibin Mohan, University of Illinois UC, USA Vincent Nelis, Polytechnic Institute of Porto, Portugal Lee Pike, Galois Inc., USA Zhengwei Qi, Shanghai Jiao Tong University, China Jean-Pierre Talpin, INRIA, France Chun Jason Xue, City University of Hong Kong, Hong Kong Youtao Zhang, University of Pittsburgh, USA Wei Zhang, Virginia Commonwealth University, USA Track 3: Emerging Embedded Applications and Interdisciplinary (EAI) Alessio Bechini, University of Pisa, Italy David Broman, KTH Royal Institute of Technology/UC Berkeley, Sweden/USA Qing Cao, University of Tennessee, USA Yuan-Hao Chang, Academia Sinica, Taiwan Deji Chen, Tongji University, P. R. China David Eyers, University of Otago, New Zealand Mikael Gidlund, Mid Sweden University, Sweden Jen-Wei Hsieh, National Taiwan University of Science and Technology, Taiwan Robert Hsu, Chung Hua University, Taiwan Jingtong Hu, Oklahoma State University, USA Zhiyi Huang, University of Otago, New Zealand Qun Li, College of William and Mary, USA Jogesh Muppala, The Hong Kong University of Science and Technology, Hong Kong Rodolfo Pellizzoni, University of Waterloo, Canada Qixin Wang, The Hong Kong Polytechnic University, Hong Kong Thomas Watteyne, UC Berkeley/DUST Networks, USA Wenyao Xu, SUNY Buffalo, USA Fumin Zhang, Georgia Institute of Technology, USA Liqiang Zhang, Indiana University South Bend, USA | ||||||||||||||||||||||||||||||||||||||||||||||
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