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IMPACT 2011 : 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference

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Link: http://www.impact.org.tw/2011/General/
 
When Oct 19, 2011 - Oct 21, 2011
Where Taipei, Taiwan
Submission Deadline Jun 10, 2011
Notification Due Jul 15, 2011
Final Version Due Aug 15, 2011
Categories    microsystems   package   assembly   circuits
 

Call For Papers

2011 is full of expectations! Tablet PC, smart phones, smart TV, cutting-edge medical electronics and countless portable devices sparkle in global market. While materials fluctuate, downstream companies develop innovative technology. This annual big event is your great chance to meet Taiwan’s strengths and to update worldwide tendencies.

IMPACT 2011 as the sixth conference, jointly organized by IEEE CPMT-Taipei, ITRI, IMAPS-Taiwan, I-Shou University, SIPO and TPCA, points the theme that IMPACT - Leading Innovation to bring together researchers, engineers and experts actively engaged in such a distinguished gathering. IMPACT conference is acknowledged for its intense connection between industries and academia. You are encouraged to submit your papers to IMPACT online data pool and enjoy the global packaging feast.

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