The 2025 IEEE XXXII International Conference on Electronics, Electrical Engineering and Computing – INTERCON 2025 -- Index SCOPUS

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Abbreviation：INTERCON 2025
Perú, Arequipa| August 20 to 22, 2025
Website: https://intercon.org.pe/
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The 2025 IEEE XXXII International Conference on Electronics, Electrical Engineering and Computing – INTERCON aims to bring together researchers, professionals, students, and entrepreneurs to foster collaboration, address global challenges, and promote the development of technologies that benefit humanity.

INTERCON is a prestigious IEEE technical conference organized by the IEEE Peru Section, recognized for its commitment to innovation and excellence in engineering and computing.

The 2025 edition will be held in person in the city of Arequipa, Peru, and will be co-organized by the Universidad Católica Santa María (UCSM) and its IEEE UCSM Student Branch. This year’s theme draws inspiration from the IEEE Future Directions platforms, with a focus on transformative and emerging technologies.

We warmly invite you to submit your technical papers for oral, on-site presentations. INTERCON 2025 will continue its tradition of providing a vibrant and dynamic platform for knowledge exchange, research dissemination, and collaboration between academia, industry, and innovators—further advancing IEEE’s mission to foster technology for the benefit of humanity.

☛Important Dates
Full Paper Submission Deadline (Last Call): June 15
Notification of Acceptance: July 1
Camera-Ready Submission: July 20
Author Registration Deadline: July 20
Oral Presentations: August 20–22

☛Submission Guidelines
The offcial language of INTERCON 2025 is ENGLISH. The maximum number of authors per paper, including co-authors, is six (6). Papers must be submitted in PDF format and be between six (6) and eight (8) pages long, following the https://www.ieee.org/conferences/publishing/templates
We will use EasyChair system for submissions here: https://easychair.org/conferences/?conf=intercon2025
Accepted papers must be presented on-site to be eligible for submission to the IEEE Xplore Digital Library.

☛List of Topics
T1. Artificial Intelligence and Machine Learning
T2. Communications and Networking
T3. Power, Energy, and Power Electronics
T4. Biomedical Engineering & Healthcare Technologies
T5. Robotics, Control, Instrumentation, and Automation
T6. Multimedia Signal Proccesing and Analytics
T7. Devices, Circuits, and Materials
T8. Data Science and Computing Technologies
T9. Education in Engineering and Technology

☛Venue
The conference will be held in person at Universidad Católica Santa María (UCSM), in the city of Arequipa, Peru.

☛Contact
All questions about submissions should be emailed to intercon@ieee.org.pe