We sincerely invite you to submit papers to be published and presented at the 29th International Conference on Computational & Experimental Engineering and Sciences (ICCES2023), which will be held in Shenzhen, China, during May 2-5, 2023. Authors of accepted full papers are encouraged to apply for ICCES Outstanding Young Researcher Award and ICCES Best Student Paper Award.

***ICCES2023 will be a hybrid conference, organized in a physical location with a virtual component attached to it.

***Conference Website: https://www.iccesconf.org/

The International Conference on Computational & Experimental Engineering and Sciences (ICCES) founded in 1986 by Prof. Satya N. Atluri and Prof. Genki Yagawa is comprised of highly skilled and reputable researchers from global academia, industry and governments with expertise in computational and experimental engineering and sciences. Since its inception, ICCES has held 28 international gatherings.

ICCES2023, consisting of 60 mini-symposia, is calling for papers. All accepted regular abstracts ()200 words) will be published on ICCES Online (ISSN: 1933-2815 (online)). All accepted extended abstracts (short papers) and full-length papers (more than 6 pages) will be published by Springer, and indexed in EI Compendex, Scopus and Google Scholar for their full archival.

***Important Dates:
Abstract Submission Deadline  2023/01/10
Full Paper Submission Deadline  2023/02/10
Should you have questions, please feel free to contact us.

***Themes:
Data Driven Computational Modeling
Biomedical Engineering
Sound & Vibration
Computational & Experimental Materials & Design
Engineering and Experimental Sciences
Modern Computational Methods
Modern Developments in Mechanics of Materials & Structures

***Awards:
The Satya N. Atluri Award
Life-time Achievement Award
The Wei-zang Chien Award
The ICCES Eric Reissner Award
T.H.H. PIAN Award
The Kobayashi Award
ICCES Outstanding Young Researcher Award
ICCES Best Student Paper Award

***Should you have any questions, please feel free to contact us icces@techscience.com.