posted by user: AEIC_keo || 777 views || tracked by 1 users: [display]

EMIE 2026 : 2026 6th International Conference on Electronic Materials and Information Engineering

FacebookTwitterLinkedInGoogle

Link: https://ais.cn/u/RrIzUf
 
When Jul 17, 2026 - Jul 19, 2026
Where Harbin, China
Submission Deadline Jul 3, 2026
Final Version Due Jul 15, 2026
Categories    electronics   materials   information engineering   communications
 

Call For Papers

2026 6th International Conference on Electronic Materials and Information Engineering (EMIE 2026) will be held in Harbin, China from July 17 to 19, 2026.

๐—–๐—ผ๐—ป๐—ณ๐—ฒ๐—ฟ๐—ฒ๐—ป๐—ฐ๐—ฒ ๐—ช๐—ฒ๐—ฏ๐˜€๐—ถ๐˜๐—ฒ: https://ais.cn/u/RrIzUf

---๐—–๐—ฎ๐—น๐—น ๐—ณ๐—ผ๐—ฟ ๐—ฝ๐—ฎ๐—ฝ๐—ฒ๐—ฟ๐˜€---
The topics of interest for submission include, but are not limited to:
โ—•Electronic materials
Physical chemistry
Semiconductor material
Conductive metals and their alloys
Electromagnetic shielding material
Dielectric material
Piezoelectric and ferroelectric materials
Magnetic material
Optoelectronic material
Integrated circuit

โ—•Information engineering:
Electronic science and technology
Information and communication Engineering
Optoelectronic information science and technology
Engineering optics
Information optics
Electronic technology
Photoelectric technology
Communication technology
Measurement and control technology
Computer application technology

---๐—ฆ๐—ฝ๐—ฒ๐—ฎ๐—ธ๐—ฒ๐—ฟ๐˜€---
Prof. Jiankun Hu,IEEE Fellow,The University of New South Wales (UNSW), Australia
Prof. Lei Zhang,Nanjing University of Information Science and Technology, China

---๐—ฃ๐˜‚๐—ฏ๐—น๐—ถ๐—ฐ๐—ฎ๐˜๐—ถ๐—ผ๐—ป---
All papers, both invited and contributed, will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers of EMIE 2026 will be published in SPIE - The International Society for Optical Engineering (ISSN: 0277-786X), and indexed by EI Compendex and Scopus.

---๐—œ๐—บ๐—ฝ๐—ผ๐—ฟ๐˜๐—ฎ๐—ป๐˜ ๐——๐—ฎ๐˜๐—ฒ๐˜€---
Submission Deadline: July 3, 2026
Registration Deadline: July 10, 2026
Final Paper Submission Date: July 15, 2026
Conference Dates: July 17-19, 2026

---๐—ฃ๐—ฎ๐—ฝ๐—ฒ๐—ฟ ๐—ฆ๐˜‚๐—ฏ๐—บ๐—ถ๐˜€๐˜€๐—ถ๐—ผ๐—ป---
Please send the full paper(word+pdf) to Submission System:
https://ais.cn/u/RrIzUf

Related Resources

Ei/Scopus-AI2A 2026   2026 IEEE 6th International Conference on Artificial Intelligence, Automation and Algorithms (AI2A 2026)
AGRETA 2026   4th IEEE International Conference on Agrosystem Engineering, Technology & Applications
Ei/Scopus-ACEPE 2026   2026 3rd IEEE Asia Conference on Advances in Electrical and Power Engineering (ACEPE 2026)
ISDEA 2026   Springer--2026 5th International Conference on Intelligent Systems Design and Engineering Applications (ISDEA 2026)
IEEE-MLNLP 2026   2026 IEEE 9th International Conference on Machine Learning and Natural Language Processing (MLNLP 2026)
ICRIS 2026   2026 the 6th International Conference on Robotics and Intelligent Systems (ICRIS 2026)
Ei/Scopus-CDSSC 2026   2026 International Conference on Communications, Data Science and Smart Computing (CDSSC 2026)
PROMISE 2026   International Conference on Predictive Models in Software Engineering
IJMECH 2026   International Journal of Recent Advances in Mechanical Engineering
JCICE 2026   2026 5th International Joint Conference on Information and Communication Engineering (JCICE 2026)