IEEE 2026 5th International Symposium on Semiconductor and Electronic Technology (ISSET 2026) to be held in Hefei, China, July 24-26, 2026.

𝗖𝗼𝗻𝗳𝗲𝗿𝗲𝗻𝗰𝗲 𝗪𝗲𝗯𝘀𝗶𝘁𝗲: https://ais.cn/u/bU3auy

---𝗖𝗮𝗹𝗹 𝗳𝗼𝗿 𝗽𝗮𝗽𝗲𝗿𝘀---
The topics of interest for submission include, but are not limited to:
◕ Semiconductor
· Semiconductor spin physics and topological phenomena
· Semiconductor Nano and Devices
· Wide/Narrow Band Gap Semiconductors
· Compound semiconductor
· Magnetic semiconductor
· Organic Semiconductors
· Advanced Photoresists
· Optoelectronic and Photovoltaic Devices
· Semiconductor Physics
· Semiconductor Quantum Computing
· Semiconductor Materials and Device Reliability
· Semiconductor Manufacturing and Applications
· Emerging Semiconductor Technologies
· 3D Semiconductor Device Technology
· Sensors
· Fully Integrated Automation
· Automated Inspection
......

◕ Electronic Technology
· Fiber Optics
· Electronic Information Engineering
· Information Security
· Electronic Information Technology
· Circuit Analysis and Design
· Electronic Packaging Technology
· Microelectronics Science and Engineering
· Electronics and Nanoelectronics
· Advanced Electromagnetics
· Communication Electronic Circuits
· Integrated Circuit Design and Integrated Systems
· Microwave Photonic Device Physics
· Integrated Optics
· Micro/Nano Systems and Networks
· Digital Signal Processing
· Analog Computing
· Information Processing Technology
......

---𝗣𝘂𝗯𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻---
All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted full papers will be published by IEEE (ISBN: 979-8-3195-1822-4) and submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore's scope and quality requirements, and also submitted to EI Compendex and Scopus for indexing.

---𝗜𝗺𝗽𝗼𝗿𝘁𝗮𝗻𝘁 𝗗𝗮𝘁𝗲𝘀---
Full Paper Submission: July 12, 2026
Registration Deadline: July 18, 2026
Final Paper Due: July 18, 2026
Conference Dates: July 24-26, 2026

---𝗣𝗮𝗽𝗲𝗿 𝗦𝘂𝗯𝗺𝗶𝘀𝘀𝗶𝗼𝗻---
Please send the full paper(word+pdf) to Submission System:
https://ais.cn/u/bU3auy