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Machines - SI 2023 : Special Issue - Advances in Digital Twin Technology in the Manufacturing Field | |||||||||||
Link: https://www.mdpi.com/journal/machines/special_issues/J90B6SXU4Z | |||||||||||
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Call For Papers | |||||||||||
This special issue is now open for submission.
A digital twin is a virtual representation of physical entities, e.g., equipment, processes, and products. It allows the manufacturing, automation, intralogistics, and production of service processes to be simulated, analyzed, predicted, and optimized. This Special Issue aims to publish state-of-the-art research papers and survey articles to present innovative systems, methodologies, and trends on digital twin technologies, including (but not limited to) the integration of digital twin with the advanced information and communication technologies, the design of integrated physical and digital twin systems, and digital twin applications. Keywords: integration of AI and digital twin integration of IoT/edge/cloud computing and digital twin integration of blockchain and digital twin integration of AR/VR and digital twin synchronization of the physical and digital twins digital twin for robot control and multi-robot systems digital twin for autonomous mobile robots digital twin for human robot collaboration digital twin for robotic manufacturing operations (e.g., robotic drilling, welding, etc.) digital twin for intralogistics digital twin for predictive maintenance and performance prediction digital twin for process control digital twin for security digital twin for zero defect digital twin of systems digital twin of assembly applications of digital twin Guest Editors: Dr. Declan Devine Dr. Eoin Hinchy Dr. Yuansong Qiao |
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