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SMMP 2023 : 2nd International Conference on Smart Manufacturing and Material Processing | |||||||||||
Link: http://www.icsmmp.org/ | |||||||||||
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Call For Papers | |||||||||||
SMMP2023 invites the submission of original research papers in the fields of material sciences and smart manufacturing to be published in the conference proceedings.
The response to our Call for Papers this year was great and we received proposals from all over the world. Now SMMP2023 has decided to extend the submission deadline. AND EVEN BETTER is that selected excellent papers will enjoy an excellent discount. Contributions are sought in the following areas: 1. Smart Manufacturing Technology Intelligent control system Computer integrated manufacturing system Advanced control and Optimization Technology Applications of AI Techniques in Design and Manufacturing New Sensing Technology Precision ultra-precision machining technology Laser processing technology Intelligent Manufacturing Technology Additive Manufacturing and materials processing Technology Advanced Manufacturing Production Mode Virtual Manufacturing and Network Manufacturing System Analysis and Industrial Engineering Microelectronics packaging, testing and manufacturing technology Industrial robots and automatic production line 2. Manufacturing Processes and Systems Material processing and forming Surface Engineering/Coating Tribology in Manufacturing Processes Quality Monitoring and Control of the Manufacturing Process E-manufacturing, ERP, and Integrated Factory Operations, and Production Management Machinery control and information processing technology Precision Engineering, and Concurrent Engineering Engineering Optimization 3. Materials Processing Engineering Polymer Materials Metamaterial structure design Structural strength, fatigue and stability Polymer Processing Super Alloys Advanced metal forming, bending, welding & casting techniques Fabrication Process of Nano materials and Nano devices Advanced machining processes Recycling and re-manufacturing of Materials and Components Microwave Processing of Materials Thermal Engineering Theory and Applications Thermally-Enhanced Processes and Materials Material calculation and numerical simulation Publication Accepted papers will be presented as either oral or poster at the conference, and included in the conference proceedings. Submission Guidelines All submissions must be in English with a varying length from 4 to 10 pages including figures and references, adhere to the template format in the conference website, and must be submitted to conference email address: contact@icsmmp.org. Dr. Lucy Lee Conference Secretary E-mail: contact@icsmmp.org |
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