posted by organizer: nicoladallora || 137 views || tracked by 1 users: [display]

COINS 2025 : IEEE International Conference on Omni-layer Intelligent Systems

FacebookTwitterLinkedInGoogle

 
When Aug 4, 2025 - Aug 6, 2025
Where University of Wisconsin–Madison, USA
Submission Deadline TBD
 

Call For Papers

CALL FOR PAPERS

IEEE International Conference on Omni-layer Intelligent Systems

University of Wisconsin–Madison, USA | August 4-6, 2025

https://coinsconf.com



Important Dates:

Abstract submission: 1 April 2025

Full paper submission: 8 April 2025

Special session, workshop, tutorial proposal submission: 8 April 2025

Acceptance notification: 31 May 2025

Camera-ready submission: 21 June 2025





Are you interested in taking part in shaping and adding new dimensions to the future IoT and AI ecosystem? Do you want to stay ahead and learn about the most prominent digital technologies that are radically shifting the paradigm? Or are you just curious about what IoT, AI, and Big Data are all about and how they impact every aspect of our lives, society, and business?
IEEE COINS (https://coinsconf.com) is the right place to be. IEEE COINS brings together experts in Digital Transformation (from AI and IoT to Cloud, low power design, security, privacy, and robotics) from around the globe.



IEEE COINS includes a multi-disciplinary program, from technical research papers to panels, workshops, and tutorials on the latest technology developments and innovations. IEEE COINS will address all important aspects of the of the IoT/AI ecosystem. IEEE COINS solicits papers and proposals accompanying submissions for presentations in the following topical and vertical tracks:



Topical Area Tracks

1. Internet of Things: From Edge to Cloud

2. Sensing Devices and Systems for AIoT

3. Circuits and Systems (CAS) Designs AIoT

4. Communications and Networking for AIoT

5. Artificial Intelligence, Machine Learning, and Cognitive Computing

6. Distributed Ledger Technologies and Blockchain

7. Low Power Design and Automation

8. Security and Privacy

9. Intelligent Robots and Systems

10. Embedded AI



Vertical Tracks

1. Smart Infrastructure

- Smart City

- Energy and Smart Grids

- Smart Agriculture

- Smart Mobility, Transportation, and Logistics

2. Industry 4.0 and Smart Manufacturing

3. Digital Healthcare and Well-being



Special Tracks

1. Emerging Technologies on Intelligent Systems

2. Generative AI: Systems, Architectures, and Applications



Panels

1. Diversity, Equity, and Inclusion

2. Industrial Talks

3. Workshops/Tutorials



Organizing Committee

General Co-Chairs

Umit Yusuf Ogras, University of Wisconsin-Madison

Amit Singh, University of Essex



Technical Program Co-Chairs

Fatemeh Afghah, Clemson University

Priya Panda, Yale University



Publicity Chair Co-Chair

Aly Sabri Abdalla, Mississippi State University

Nicola Dall' Ora, University of Verona, Italy

Jaeha Kung, Korea University

Sumit K Mandal, IISC Bangalore

Oktay Cetinkaya, Univ. of New Castle

Related Resources

IEEE COINS 2024   6th IEEE International Conference on Omni-Layer Intelligent systems
IEEE-Ei/Scopus-ITCC 2025   2025 5th International Conference on Information Technology and Cloud Computing (ITCC 2025)-EI Compendex
IEEE BDAI 2025   IEEE--2025 the 8th International Conference on Big Data and Artificial Intelligence (BDAI 2025)
IEEE ACIRS 2025   IEEE--2025 10th Asia-Pacific Conference on Intelligent Robot Systems (ACIRS 2025)
IEEE AMCAI 2025   IEEE Afro-Mediterranean Conference on Artificial Intelligence
IEEE ICEEE 2025   IEEE--2025 12th International Conference On Electrical And Electronics Engineering (ICEEE 2025)
IEEE SMC 2025   2025 IEEE International Conference on Systems, Man, and Cybernetics
IEEE RO-MAN 2025   34th IEEE International Conference on Robot and Human Interactive Communication
IEEE DAPPS 2025   The 7th IEEE International Conference on Decentralized Applications and Infrastructures
IEEE IRCE 2025   IEEE--2025 The 8th International Conference on Intelligent Robotics and Control Engineering (IRCE 2025)