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VTCFall 2023 : Call For Papers IEEE VTC2023-FALL | |||||||||||
Link: https://events.vtsociety.org/vtc2023-fall/authors/call-for-papers-2/ | |||||||||||
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Call For Papers | |||||||||||
VTC2023-Fall in Hong Kong will feature world-class technical sessions, workshops, and tutorials on, but not limited to, the following technical tracks. Prospective authors are invited to submit 5-page, original, and unpublished full papers. A full paper can be up to 7 pages in length, just note that papers longer than 5 pages will require the purchase of additional page charges at the time of registration and final paper submission. Please do not submit papers longer than 8 pages for review as it is not likely that the paper could be edited to a maximum of 7 pages or less upon acceptance.
1. Antenna Systems, Propagation, and RF Design 2. Electric Vehicles, Vehicular Electronics and Intelligent Transportation 3. Emerging Technologies, 5G and Beyond 4. IoV, IoT, M2M, Sensor Networks, and Ad-Hoc Networking 5. Machine Learning and AI for Communications 6. Positioning, Navigation, and Mobile Satellite Systems 7. Radio Access Technology and Heterogeneous Networks 8. Spectrum Management, Green Communications, Services and Security 9. Signal Transmission and Reception 10.Unmanned Aerial Vehicle Communications, Vehicular Networks, and Telematics 11.Wireless Networks: Protocols, Security and Services ************************************************************************************************ Paper submission deadline: 9 July 2023 Acceptance notification: 26 August 2023 Final paper submission deadline: 9 September 2023 Submission requirements: 5-page paper (without overlength charge) and up to 2 additional pages are allowed with the purchase of additional page charges in the amount of $100 USD per additional page at the time of registration and final paper submission. Paper submission is open: https://vtc2023fall.trackchair.com/ ************************************************************************************************ Organizing Committee: General Co-Chairs Khaled B. Letaief, Hong Kong University of Science and Technology, Hong Kong Song Guo, The Hong Kong Polytechnic University, Hong Kong Technical Program Chair Xianbin Wang, Western University, Canada Technical Program Vice-Chairs Jianping Wang, City University of Hong Kong, Hong Kong Dusit Niyato, Nanyang Technological University, Singapore Publications Chair James Irvine, University of Strathclyde, UK Soumaya Cherkaoui, Polytechnique Montreal, Canada Fiona Fang, Western University, Canada Keynotes & Panels Co-Chairs Nirwan Ansari, New Jersey Institute of Technology, USA Lajos Hanzo, University of Southampton, UK Tutorials Chair Deze Zeng, China University of Geosciences (Wuhan), China Peng Li, University of Aizu, Japn Workshops Co-Chairs Shui Yu, University of Technology Sydney, Australia Keshav Sood, Deakin University, Canada Industry Program Chair Taimoor Abbas, InterDigital, Inc, USA Publicity Chair Kan Zheng, Ningbo University, China Fulvio Babich, University of Trieste, Italy Local Arrangements Chair Zhenjiang Li, City University of Hong Kong, Hong Kong Wenchao Xu, Hong Kong Polytechnic University, Hong Kong Finance Chair J. R. Cruz, The University of Oklahoma, USA Conference Administrators Rodney C. Keele, The University of Oklahoma, USA Cerry Leffler, The University of Oklahoma, USA |
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