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CMPAI 2026 : 2026 International Conference on Condensed Matter Physics and Artificial Intelligence

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Link: https://www.aischolar.com/conference/cmpai2026?invite=wiki
 
When Apr 17, 2026 - Apr 19, 2026
Where San Francisco, USA/ Hybrid
Submission Deadline Jan 31, 2026
Final Version Due Mar 31, 2026
Categories    physics   artificial intelligence   materials   condensed matter physics
 

Call For Papers

2026 International Conference on Condensed Matter Physics and Artificial Intelligence(CMPAI 2026) will be held on April 17-19, 2026 in San Francisco, USA/ Hybrid.

๐—–๐—ผ๐—ป๐—ณ๐—ฒ๐—ฟ๐—ฒ๐—ป๐—ฐ๐—ฒ ๐—ช๐—ฒ๐—ฏ๐˜€๐—ถ๐˜๐—ฒ: https://www.aischolar.com/conference/cmpai2026?invite=wiki

---๐—–๐—ฎ๐—น๐—น ๐—™๐—ผ๐—ฟ ๐—ฃ๐—ฎ๐—ฝ๐—ฒ๐—ฟ๐˜€---
The topics of interest for submission include, but are not limited to:
โ—• AI in Superconductivity and Magnetism
Design and optimization of superconducting materials
Prediction of magnetic properties and new phases
AI-assisted study of superconducting and magnetic mechanisms
Machine learning applications in magnetic quantum materials
Intelligent experimental data processing and analysis
Smart control for superconducting devices

โ—• AI in Low-dimensional and Topological Physics
Identification and classification of topological materials
Electronic state analysis in low-dimensional systems
Topological quantum computing and information processing
Dynamics simulations of low-dimensional heterostructures
Detection of topological phases and experimental data analysis

โ—• AI in Non-equilibrium and Statistical Physics
Simulations of non-equilibrium dynamics and phase transitions
Modeling of many-body system dynamics
Analysis of thermal transport and energy conversion
Theoretical modeling of non-equilibrium systems
Deep learning in complex dissipative systems
Integration of intelligent simulations with experimental data

โ—• Intelligent Methods in Computational and Materials Physics
AI-assisted electronic structure calculations
Multiscale materials simulations with machine learning
High-throughput materials screening and design
Analysis of defects and interfaces in electronic structures
Machine-learned potentials and accelerated simulations
AI research in energy materials
Other ...

---๐—ฆ๐—ฝ๐—ฒ๐—ฎ๐—ธ๐—ฒ๐—ฟ๐˜€ (๐—œ๐—ป๐˜๐—ฒ๐—ป๐—ฑ ๐˜๐—ผ ๐—ถ๐—ป๐˜ƒ๐—ถ๐˜๐—ฒ)---
Prof. Daowen Qiu,Sun Yat-sen University, China
Assoc. Prof. Siow Kim Shyong,The National University of Malaysia, Malaysia

---๐—ฃ๐˜‚๐—ฏ๐—น๐—ถ๐—ฐ๐—ฎ๐˜๐—ถ๐—ผ๐—ป---
All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted full papers of CMPAI 2026 will be published in the conference proceedings and will be submitted to EI Compendex and Scopus for indexing.

---๐—œ๐—บ๐—ฝ๐—ผ๐—ฟ๐˜๐—ฎ๐—ป๐˜ ๐——๐—ฎ๐˜๐—ฒ๐˜€---
Full Paper Submission Date: January 31, 2026
Registration Deadline: March 31, 2026
Final Paper Submission Date: March 31, 2026
Conference Dates: April 17-19, 2026

--- ๐—ฃ๐—ฎ๐—ฝ๐—ฒ๐—ฟ ๐—ฆ๐˜‚๐—ฏ๐—บ๐—ถ๐˜€๐˜€๐—ถ๐—ผ๐—ป---
Please send the abstract or full paper(word+pdf) to Submission System:
https://www.aischolar.com/conference/cmpai2026/submission?invite=wiki

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