CALL FOR PAPERS
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2nd International Workshop on Managing Technical Debt (MTD 2011) co-located with the 33rd International Conference on Software Engineering (ICSE 2011)

May 23, 2011
Waikiki, Honolulu, Hawaii, USA

Web: http://www.sei.cmu.edu/community/td2011/
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IMPORTANT DATES

Submission Deadline: Jan. 21, 2011
Acceptance Notification: Feb. 11, 2011
Camera-Ready Version: Mar. 10, 2011
Workshop: May 23, 2011

Delivering complex, large-scale systems faces the ongoing challenge of how best to balance rapid deployment with long-term value. The technical debt metaphor is gaining significant traction in the software development community, as a way to understand and communicate issues of intrinsic quality, value, and cost.

The idea is that developers sometimes accept compromises in a system in one dimension (e.g., modularity) to meet an urgent demand in some other dimension (e.g., a deadline), and that such compromises incur a debt on which interest has to be paid and which should be repaid at some point for the long-term health of the project.

There is increasing necessity to address theoretical foundations and empirical evidence for analyzing and optimizing short-term versus long-term goals in large scale projects. This workshop proposes to put managing technical debt as a part of the research agenda for the software engineering field. The goal of the workshop is to bring together leading researchers and practitioners for the purpose of exploring the open questions.

MTD 2011 seeks contributions addressing, but not limited to, the following topics:

* Techniques for identifying and monitoring technical debt
* Types of technical debt in industrial settings
* Key parameters that help elicit, communicate, and manage technical debt quantitatively
* Lifetime of technical debt
* Relationship of technical debt to code quality and defect analysis
* Technical debt throughout the software development lifecycle
* Relationship of technical debt to evolution and maintenance activities
* Empirically collecting information about technical debt
* Measurment and payoff strategies for technical debt
* Metrics for analyzing technical debt
* Visualization of technical debt
* Using technical debt strategically
* Relationship of technical debt to different software development activities (requirements debt, architectural debt, testing debt)


SUBMISSIONS
We invite submissions of papers in any areas related to the themes and goals of the workshop in the following categories:
1. position and future trend papers-describing ongoing research, new results, and future trends (4 pages)
2. research papers-describing innovative and significant original research in the field (8 pages)
3. industrial papers-describing industrial experience, case studies, challenges, problems and solutions (8 pages)

Contributors are requested to submit their papers through CyberChair Pro. The specific submission link will be announced at the workshop website as soon as it is available (http://www.sei.cmu.edu/community/td2011/). Submissions should be original and unpublished work. Each submitted paper will undergo a rigorous review process by three members of the Program Committee. All types of papers must conform to the ICSE submission format and guidelines. All accepted papers will appear in the ACM Digital Library.

ORGANIZERS
Ipek Ozkaya, Software Engineering Institute, USA
Philippe Kruchten, University of British Columbia, Canada
Rod Nord, Software Engineering Institute, USA
Nanette Brown, Software Engineering Institute, USA

PROGRAM COMMITTEE
Eric Bouwers, Technical University Delft, Netherlands
Yuangfang Cal, Drexel University, USA
Rafael Capilla, Universidad Rey Juan Carlos, Spain
Jeromy Carriere, eBay, USA
Ward Cunningham, AboutUs, USA
Hakan Erdogmus, Kalemun Research, Canada
David Garlan, Carnegie Mellon University, USA
Israel Gat, Cutter Consortium, USA
Jim Highsmith, ThoughtWorks, USA
Rick Kazman, University of Hawaii and the Software Engineering Institute, USA
Miryung Kim, University of Texas, USA
Tobias Kuipers, Software Improvement Group, Netherlands
Erin Lim, University of British Columbia, Canada
Alan MacCormack, MIT, USA
Steve McConnell, Construx, USA
Don O'Connell, Boeing, USA
Raghu Sangwan, Penn State University, USA
Carolyn Seaman, University of Maryland, USA
Kevin Sullivan, University of Virginia, USA