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IEEE MASS 2023 : IEEE MASS 2023 -- IEEE International Conference on Mobile Ad- Hoc and Smart Systems | |||||||||||||
Link: https://cis.temple.edu/ieeemass2023/ | |||||||||||||
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Call For Papers | |||||||||||||
The 20th IEEE International Conference on Mobile Ad-Hoc and Smart Systems (MASS 2023), Toronto, Canada, September 25 - 27, 2023
https://cis.temple.edu/ieeemass2023/ Sponsored by the IEEE Computer Society and IEEE Computer Society's TCDP, the 20th edition of the IEEE International Conference on Mobile Ad-Hoc and Smart Systems (MASS) will be held in Toronto, Canada in September 2023, and it aims at bringing together researchers, developers, and practitioners to address recent advances in mobile ad-hoc and smart systems, covering algorithms, theory, protocols, systems & applications, experimental evaluations and testbeds, security/privacy, as well as AI/ML-based smart design. We are pleased to invite you to submit original contributions to IEEE MASS 2023. All original, unpublished contributions are solicited in all aspects of mobile ad hoc networks (MANETs) and smart systems, from mobile networking/computing to cyber-physical systems to Internet of Things, from theory to systems and applications. All submissions will be peer-reviewed based on relevance, originality, importance and clarity. Topics of interest include, but are not limited to: * 5G networks and technologies * AI/ML for smart wireless networks * AI and machine learning aided protocol design and resource allocation * AI and machine learning based applications for ad hoc networks * Algorithms for MANETs and WSNs * Application Layer Protocols * Clustering, topology control, coverage, and connectivity * Cognitive networking * Cooperative and cognitive communication * Cooperative sensing, compressive sensing, sensing from communications * Cloud, crowd-sourced, participatory and (mobile) social sensing * Cyber-physical systems and applications * Data gathering, fusion, and dissemination * Energy-efficient architectures, algorithms, and protocols * Experiences in real-world applications and deployments * Flying Ad-Hoc Networks * Free-space optical networks * Heterogeneous networks * Internet of Things (IoT) devices, gateways, and infrastructure * Light-weight distributed machine learning * Localization and Location Based Services * Measurements, experimental systems and test-beds * Mobile computing and networking * mmWave and Terahertz networks * Mobility modeling and management * Multi-channel, multi-radio and MIMO technologies * Network components, operating systems, and middleware * Opportunistic networking, delay tolerant networking * QoS and Resource management * Robotic networks * Routing protocols * Scalability, stability, and robustness of networks and sensor systems * Security and privacy at all layers, including the physical layer * Sensor enabled drone, UAV, UUV systems * Smart grid, healthcare, transportation applications * Vehicular networks and protocols * Visible light communications * Wearable and human-centric devices and networks All submissions will be peer-reviewed on the basis of relevance, originality, importance, and clarity. *Submissions Guidelines and Proceedings* Authors are invited to submit original, unpublished research papers that are not currently under review elsewhere. All submissions should be written in English with a maximum length of 9 single-spaced, double-column pages using 10pt fonts on 8.5 in x 11 in paper, including all figures, tables, and references, in PDF format. Authors must use the Manuscript Templates for IEEE Conference Proceedings. Accepted papers will appear in the conference proceedings published by IEEE and will be presented at the conference. Based on TPC reviews and discussions, some papers may be accepted as 5-page short papers or 2-page posters in addition to the regular 9-page papers. For all papers, IEEE reserves the right to exclude the paper from distribution after the conference (e.g., removal from IEEE Xplore) if the paper is not presented at the conference. Note that the conference will also include a poster and demo session. Submission Site: https://edas.info/N30530 *Important Dates* Paper submission due: Monday, April 24, 2023 (Extended) Acceptance notification: Monday, June 26, 2023 Camera-ready version: Monday, July 17, 2023 Conference date: September 25-27, 2023 *General Co-Chairs* J.J. Garcia-Luna-Aceves, University of California, Santa Cruz, USA Guoliang Xing, the Chinese University of Hong Kong, China *Program Co-Chairs* Yu Wang, Temple University, USA Eyuphan Bulut, Virginia Commonwealth University, USA *Track Chairs* *Algorithms and Theory Weifa Liang, City University of Hong Kong, China Yingshu Li, Georgia State University, USA *Artificial Intelligence/Machine Learning-based Smart Design Tamer Nadeem, Virginia Commonwealth University, USA Bin Li, Pennsylvania State University, USA *Protocols and Emerging Technologies Karl Anderson, Luleå University of Technology, Sweden Fan Li, Beijing Institute of Technology, China *Security and Privacy Muhammad Shahzad, North Carolina State University, USA Yan Wang, Temple University, USA *Systems and Applications Kate Lin, National Chiao Tung University, Taiwan Tao Han, New Jersey Institute of Technology, USA *Workshop Co-Chairs Eirini Eleni Tsiropoulou, University of New Mexico, USA Nils Aschenbruck, Osnabrück University, Germany *Poster & Demo Chair Zhichao Cao, Michigan State University, USA *Local Arrangements Chair Wenbo He, McMaster University, Canada *Publication Chair Dajin Wang, Montclair State University, USA *Publicity Co-Chairs Marcelo Carvalho, University of Brasília, Brazil Xiangmao Chang, Nanjing University of Aeronautics and Astronautics, China Shiwei Fang, University of Massachusetts Amherst, USA Qun Song, Delft University of Technology, Netherlands *Web Co-Chairs A B M Mohaimenur (Bivor) Rahman, UNC Charlotte, USA Xinliang Wei, Temple University, USA *Registration & Finance Chair Shuhui Yang, Purdue University Northwest, USA *Steering Committee Jie Wu (chair), Temple University, USA Elizabeth Belding, UC Santa Barbara, USA Falko Dressler, Technical University of Berlin, Germany J. J. Garcia-Luna-Aceves, UC Santa Cruz, USA Kang G. Shin, University of Michigan, USA |
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