posted by system || 2434 views || tracked by 2 users: [display]

IMPACT 2008 : 3rd Intl. Microsystems, Packaging, Assembly & Circuits Technology Conf.

FacebookTwitterLinkedInGoogle

Link: http://www.impact-emap.org/2008/CallPaper/
 
When Oct 22, 2008 - Oct 24, 2008
Where Taipei, Taiwan
Submission Deadline May 31, 2008
Categories    manufacturing
 

Call For Papers

[Empty]

Related Resources

IEEE AIxVR 2026   8th International Conference on Artificial Intelligence & extended and Virtual Reality
IEEE-ISRIMT 2025   2025 7th International Symposium on Robotics & Intelligent Manufacturing Technology-IEEE Xplore/EI/Scopus
AIChE Spring Meeting & GCPS 2026   2026 AIChE Spring Meeting & 22nd Global Congress on Process Safety
EI/Scopus-IMAEIT 2025   2025 International conference on Intelligent Mechanical Automation and Equipment Innovation Technology-EI/Scopus
A&WMA ACE 2026   A&WMA's 119th Annual Conference & Exhibition: Energizing the Future
EI/Scopus-ICMSP 2025   2025 7th International Conference on Intelligent Control, Measurement and Signal Processing-EI/Scopus
Ei/Scopus-CEICE 2026   2026 3rd International Conference on Electrical, Information and Communication Engineering (CEICE 2026)
IEEE-EICARS 2025   2025 International Conference on Electronic Information, Computer and Aerospace Remote Sensing-IEEE Xplore/EI/Scopus
SSGRB 2026   3rd Sustainable Solutions for Growth - Research and Business
MSIE 2026   2026 8th International Conference on Management Science and Industrial Engineering (MSIE 2026)