Home Categories
CFPs Conf Series
My List
My Archive
On iPhone
On Android
posted by system || 2872 views || tracked by 2 users: [display]

EDAPS 2008 : Electrical Design of Advanced Packaging and Systems Symposium

FacebookTwitterLinkedInGoogle

Link: http://www.edaps2008.org/Contents/Callforpaper.asp%20globalmenu=5&localmenu=1
 
When Dec 10, 2008 - Dec 12, 2008
Where Seoul, South Korea
Submission Deadline Jul 31, 2008
Categories    manufacturing
 

Call For Papers

[Empty]

Related Resources

ICDIS 2026   3rd International Symposium on Integrated Circuit Design and Integrated Systems
ICAISM 2026   2026 2nd International Conference on Artificial Intelligence and Smart Manufacturing-EI/Scopus
GA 2026   XXIX Generative Art International Conference
MSEJ 2026   Advances in Materials Science and Engineering: An International Journal
AINOW 2026   The Second International Conference on Advances in AI-based Systems and Applications
ICCRT 2026   2026 4th International Conference on Control and Robot Technology (ICCRT 2026)
Transition Design Conference 2026   Transition Design Conference 2026: Weaving Regenerative Futures
HCIML 2026   2026 International Conference on Human-Computer Interaction and Machine Learning-EI/Scopus
ACDL 2026   9th Advanced Course on Data Science & Machine Learning
LMAM 2026   2026 International Academic Conference on Lasers, Materials, and Advanced Manufacturing-EI/Scopus
About Us | Contact Us | Data | Privacy Policy | Terms and Conditions
Partners: AI2's Semantic Scholar
This wiki is licensed under a Creative Commons Attribution-Share Alike 3.0 License.