2014 The 4th International Conference on Mechatronics and Intelligent Materials
MIM 2014
LiJiang, China
May 18-19, 2014
www.hk-ceis.com/mim2014



TTP杂志社（AMR期刊出版社）关于本次会议的合作公告http://www.scientific.net/conference-1005

General Information

On the successful basis of MIM 2011, 2012 and 2013, 2014 The 4th International Conference on Mechatronics and Intelligent Materials (MIM 2014) will be held in LiJiang, during May 18-19, 2014. MIM 2014 is sponsored by HongKong Control Engineering and Information Science Research Association (CEIS), International Frontiers of science and technology Research Association (IFST), National Chin-Yi University of Technology and Trans tech publications inc.

The conference is an international forum for the presentation of technological advances and research results in the fields of Mechatronics Technology and Materials Science. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. We warmly welcome previous and prospected authors submit your new research papers to MIM 2014, and share the valuable experiences with the scientist and scholars around the world.



MIM 2014 ONLY accepts unpublished research papers. All papers, both invited and contributed, will be refereed. All accept papers will be published in international journal Advanced Materials Research (ISSN: 1022-6680) , which are online available in full text via the platform www.scientific.net. All accept papers will be indexed by EI Compendex and ISTP.
Applied Mechanics and Materials (ISSN: 1660-9366) and Advanced Materials Research (ISSN: 1022-6680) are Indexed by Elsevier: SCOPUS www.scopus.com and Ei Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science) www.isinet.com, Institution of Electrical Engineers (IEE) www.iee.org, etc.

Topics of interest include, but are not limited to:
1. Mechatronics 2. Materials
Automobile and Electronic Technology Multifunctional Materials
Digital Design and Manufacturing Technology Materials fabrication
Vehicle Electronic Control and Measurement Techniques Active Materials, Mechanics and Behavior
Measurement and Control of Vibration and Noise Nonmaterial
Dynamic Monitoring and Fault Diagnosis for Equipment Materials forming
Mechatronics and Robotics Materials machining
Fault Diagnosis Building materials
Vibration and Noise Energy materials
Sensors and MEMS Other materials related
3. Manufacturing and Design Science 4. Control, Computer and Automation
Green design and manufacturing Intelligent Control
CAD/CAM/CAE/CNC Artificial Intelligence
Manufacturing process simulation Signal Processing Theory
Virtual manufacturing Image & Video Signal Processing
Digital and agile manufacturing Control Theory and Applications
PDM, ERP, logistics and supply chain Computer Science
5. Others


Important Date:
Mar 31, 2014 Full manuscript submission
Apr 05, 2014 Acceptance notification
Apr 15, 2014 Conference Registration
May 18-19, 2014 Conference dates
Submisssion Methods:

Before you send the manuscript and Paper Submission Form to the mim2014@vip.163.com, Please make sure your manuscript files will have a filename "Topic field" Paper title.doc" and your paper Submission Form will have a filename "Topic field" Paper Submission Form.xls

For example:
(02) A New Co-training Approach based on SVM for Image Retrieval.doc
(02) Paper Submission Form.xls
If you have any questions, please contact us
mim2014@vip.163.com
中文投稿说明：
1、本次会议只接收英文文章，中文文章将无法出版和检索。
2、请严格按照模板进行排版。全文长度不能超过4页，超页需要加收超页费用。
3、请将要提交的文章更名为：“（主题范围区）论文名.doc或pdf”；并将论文登记表更名为“（主题范围区）Paper Submission Form.xls”。如下所示：
(02) A New Co-training Approach based on SVM for Image Retrieval.doc
(02) Paper Submission Form.xls
请将文章和论文登记表发送至
E-mail: mim2014@vip.163.com
Ms. Zhong, MIM Editor, China

E-mail: mim2014@vip.163.com

Website: http://www.hk-ceis.com/mim2014
QQ Group: 158104893
023-86238625
13399894917