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eMDC & ISSM 2011 : e-Manufacturing & Design Collaboration Symposium & International Symposium on Semiconductor Manufacturing (eMDC & ISSM) | |||||||||||||||
Link: http://www.tsia.org.tw/Seminar/eManufacturing/2011/ | |||||||||||||||
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Call For Papers | |||||||||||||||
In collaboration with ISSM, this joint Symposium attends to recent technological advancements to align the needs of designers, manufacturers, equipment suppliers, software vendors, solution providers and researchers. It offers a public arena for the exchange of up-to-date experiences among manufacturers for adoption of technological developments. With green notions of supply/engineering/value chains, coverage of the joint symposium includes, but not limited to, the following topics of interests:
* Advanced Lithography * Benefits and Justification (ROI, CoO, OEE ...) * Contamination Control and Ultraclean Technology * Control Architecture/Engineering/IT Infrastructure * Cross-industrial Applications of PV/SSL/FPD/… * Data Collection/Quality/Storage/Management * Design for Manufacturing/Testing/Yield * e-Diagnostics, e-Manufacturing, and EEC * Engineering/Supply/Value Chains * Environment, Safety and Health * Equipment Control/Integration * Fab Management/Scheduling/Dispatching * Factory Design & Automated Material Handling * Factory Integration/Operations * Factory Physics & Queueing Operations * Fault Detection/Classification and Sensors * Final/Lean/Green Manufacturing * Manufacturing Control and Execution Systems * Manufacturing Strategy and Operation Management * Next Generation Factory & 450mm Wafers * Predictive/Preventive Maintenance * Process and Material Optimization * Process and Metrology Equipment * Process Control and Monitoring * Process Modeling and Model-Based Simulations * Process/Tool/Sensor Integrations * Standards (Equipment, Communications, …) * Through Silicon Via & 3D Structures * Ultra High Productivity in High-Volume Manufacturing * Yield Enhancement and WIP Management |
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