*** International Workshop on Advanced Network Technologies and IoT ***
*** https://tsp.vutbr.cz/documents/TSP2020_CFP_WS2_v1.pdf ***

2020 43rd International Conference on Telecommunications and Signal Processing (TSP)
July 7-9, 2020, Milan, Italy
Web: http://tsp.vutbr.cz/

Full Paper Submissions: March 15, 2020 (extended deadline)

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Technical co-sponsors: IEEE Region 8 (Europe, Middle East and Africa), IEEE Italy Section, Italy Section SP Chapter, Italy Section VT/COM Joint Chapter, IEEE Czechoslovakia Section, IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, and Scientific Association for Infocommunications, a Sister Society of the IEEE and the IEEE Communications Society.

The TSP 2020 Proceedings, containing presented papers at the Conference, will be submitted for indexing to the IEEE Xplore® Digital Library - IEEE Conference Record #49548, SCOPUS, Conference Proceedings Citation Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases.

After the conference, authors of about 25% highest rated papers will also be invited to submit the extended version for publishing in Special Journal Issues (papers to be published after significant extension and new review process):

• Special Issue Selected Papers from the 2020 43rd International Conference on Telecommunications and Signal Processing (TSP) of an Applied Sciences (ISSN 2076-3417), an international peer-reviewed open access journal on all aspects of applied natural sciences published by MDPI and indexed by Web of Science (2018 JCR Q3; current Impact Factor: 2.217)
• International Journal of Advances in Telecommunications, Electrotechnics, Signals and Systems (IJATES) (ISSN 1805-5443), indexed by Google Scholar, CrossRef, WorldCat, EZB Elektronischen Zeitschriftenbibliothek, and Directory of Open Access Journals
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GENERAL INFORMATION:

During the past few years, key functionalities and elements of computer networks have shown tremendous evolution. Examples include new congestion control algorithms that have challenged paradigms established over 30 years ago; continued evolution of Software-defined Networks (SDNs) and Network Function Virtualization (NFV); network programmability at the data plane and the advent of the P4 language that facilitate custom network designs and enhance performance; offloading of functions to network interface cards and switches; and the rise of the Internet of Things (IoT) for connecting a wide variety of “things” into the Internet. While these new technologies offer potentially revolutionary benefits, many open research issues must still be addressed.

Within the framework of the 2020 43rd International Conference on Telecommunications and Signal Processing (TSP) held during July 7-9, 2020 in Milan, Italy, this workshop will enable practitioners and researchers to present and discuss novel approaches, solutions, and recent results that help answering research questions on advanced network technologies and IoT. Topics include, but are not limited to:

• Architectures, protocols and standards
• Programmable switches
• Transport protocols and congestion control
• P4 language
• Network Function Virtualization (NFV)
• Network Function Chaining (NFC)
• Energy efficient communication
• Fog and cloud computing architectures and technologies
• Security, privacy and reliability
• IoT infrastructure, applications, and services
• Software-Defined Networking
• QoS for mission critical communications Industrial IoT applications
• Time-sensitive networking
• Autonomous context-aware traffic classification
• Routing protocols and algorithms
• Congestion management protocols and algorithms
• Cross-platform architecture, infrastructure and performance control
• Security, privacy and reliability

For more details please visit the Conference website at https://tsp.vutbr.cz/?page_id=4461#WS2-20 .

EDITORIAL BOARD:

• Assoc. Prof. Jorge Crichigno (University of South Carolina, U.S.A.; E-mail: jcrichigno@cec.sc.edu)
• Assoc. Prof. Gautam Srivastava (Brandon University, Canada; E-mail: srivastavag@brandonu.ca)
• Prof. Dr. Neset Hikmet (University of South Carolina, U.S.A.; E-mail: nhikmet@cec.sc.edu)

STUDENT BEST PAPER AWARD:

In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, to recognize outstanding technical contributions by students, as evidenced by the quality of papers, their presentations, and their technical excellence, the authors of the Best 5 Student Papers will be awarded during the conference by the Technical Committee. The Best Student Paper Award consists in a Plaque and a Certificate of Appreciation.

TSP ORGANIZERS:

The TSP 2020 is IEEE technically co-sponsored Conference organized in cooperation with eighteen universities:

• Brno University of Technology, Department of Telecommunications, Brno, Czech Republic
• Budapest University of Technology and Economics, Department of Telecommunications and Media Informatics, Budapest, Hungary
• Czech Technical University in Prague, Department of Telecommunication Engineering, Prague, Czech Republic
• Isik University, Department of Electrical and Electronics Engineering, Sile/Istanbul, Turkey
• Istanbul Technical University, Electronics and Communication Engineering Department, Istanbul, Turkey
• Josip Juraj Strossmayer University of Osijek, Faculty of Electrical Engineering, Computer Science and Information Technology Osijek, Osijek, Croatia
• Karadeniz Technical University, Department of Electrical and Electronics Engineering, Trabzon, Turkey
• National Taiwan University of Science and Technology, Department of Electronic and Computer Engineering, Taipei, Taiwan
• Seikei University, Graduate School and Faculty of Science and Technology, Information Networking Laboratory, Tokyo, Japan
• Slovak University of Technology in Bratislava, Institute of Multimedia Information and Communication Technologies, Bratislava, Slovak Republic
• Tecnocampus, Escola Universitaria Politecnica de Mataró, Mataró, Spain
• Technical University of Sofia, Faculty of Telecommunications, Sofia, Bulgaria
• Université Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancée de Saint-Denis (LIASD), France
• University “Politehnica” of Bucharest, Center for Advanced Research on New Materials, Products and Innovative Processes (“CAMPUS”)
• University of Ljubljana, Laboratory for Telecommunications, Ljubljana, Slovenia
• University of Patras, Physics Department, Patras, Greece
• VSB - Technical University of Ostrava, Department of Telecommunications, Ostrava, Czech Republic
• West Pomeranian University of Technology, Faculty of Electrical Engineering, Szczecin, Poland

IMPORTANT DATES:

• Full Paper Submissions: March 15, 2020 (extended deadline)
• Notification of Paper Acceptance: April 15, 2020
• Final Paper Submission: April 30, 2020
• Authors' Early Registration and Payment: May 10, 2020
• Authors' Late Registration and Payment: May 20, 2020

CONTACTS:

Web: http://tsp.vutbr.cz/
E-mail: tsp@feec.vutbr.cz

Follow us on:
• Facebook https://www.facebook.com/tspconf/
• Twitter https://twitter.com/tspconf/

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TSP Organizers reserve the right to exclude a paper from distribution after the Conference (e.g., non-indexing in IEEE Xplore® and other databases) if the paper is not presented at the Conference.
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