Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters, datacenters and Clouds. This yearly conference is attended by leaders in industry and academia. The atmosphere provides for a wealth of opportunities to interact with individuals at the forefront of this field.

Themes include cross-cutting issues spanning computer systems, networking technologies, and communication protocols for high-performance interconnection networks. This conference is directed particularly at new and exciting technology and product innovations in these areas. Contributions should focus on real experimental systems, prototypes, or leading-edge products and their performance evaluation. In addition to those subscribing to the main theme of the conference, contributions are also solicited in the topics listed below.

Building on last year's successful technical program, keynotes, sessions, and panels on datacenter networking and their requirements, and solutions, in 2012 Hot Interconnects moves to the Huawei North America Headquarters, Santa Clara, CA for the conference. This year's conference focuses on data-center, virtualized, and cloud networking. We hope you can join us there.

Themes

Novel and innovative interconnect architectures
Multi-core processor interconnects
System-on-Chip Interconnects
Advanced chip-to-chip communication technologies
Optical interconnects
Protocols and interfaces for inter-processor communication
Survivability and fault-tolerance of interconnects
High-speed packet processing engines and network processors
System and storage area network architectures and protocols
High-performance host-network interface architectures
High-bandwidth and low-latency I/O
Pb/s switching and routing technologies
Innovative architectures for supporting collective communication
Novel communication architectures to support cloud computing
Centralized and distributed cloud interconnects
Requirements driving high-performance interconnects
Traffic characterization for HPC systems and commercial datacenters
Software for Network/Fabric Bring-up, Configuration and Performance
Management, e.g., OpenFlow or OpenSM
Submission Guidelines

Submission deadline: May 13, 2012
Notification of acceptance: June 16, 2012

Papers need sufficient technical detail to judge quality and suitability for presentation
Paper limit: 8 pages, 2 columns
Submit title, author, abstract, and full paper (8 pages, double-column, IEEE format)
Papers should be submitted electronically through EasyChair
About the conference

Conference held on August 22-23, 2012 at the Huawei North America Headquarters, Santa Clara, CA
Papers selected will be published in proceedings by the IEEE Computer Society
Presentations are 30-minute talks in a single-track format