DIGEST OF TECHNICAL PAPERS • 527
IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE
SUNDAY−THURSDAY, FEBRUARY 17−21, 2013 • SAN FRANCISCO MARRIOTT MARQUIS HOTEL, SAN FRANCISCO, CA
ISSCC 2013 CONFERENCE THEME: “60 YEARS OF (EM)POWERING THE FUTURE”

ISSCC 2013 is the 60th Conference in an incredibly long-lasting series. Following the invention of the transistor in 1947, there was a developing interest in ransistorcircuit design. This coalesced in 1954, with the creation of the first “Conference on Transistor Circuits”, held in Philadelphia, sponsored by the IRE, one of the predecessors of the IEEE. Since then, transistor-circuit design which evolved into integrated-circuit design has changed the world like no other technology ever has. Propelled by this sixty-year history, ISSCC 2013 will provide a special opportunity for looking back to the future, toward further exciting developments in solid-state circuits and systems. ISSCC remains the premier forum in the world where circuit innovations are presented. In this role, ISSCC will continue to (em)power the future! Innovative and original papers are solicited in subject areas including (but not limited to) the following:

ANALOG — Op-amps and instrumentation amps, baseband amplifiers, comparators, multipliers, voltage references; power-control circuits, regulators and DC-DC converters; continuous-time and discrete-time filters; consumer electronics, non-linear analog circuits, switched-capacitor circuits; synthesizers, PLLs.

DATA CONVERTERS — Nyquist-rate and oversampling A/D and D/A converters; sample-and-hold circuits; TDCs.

ENERGY-EFFICIENT DIGITAL — Energy-efficient embedded multi-core wide-operating-range processors; energy-efficient, ultra-low-voltage digital circuit techniques; adaptive techniques for variation tolerance, timing margin reduction, power optimization; integrated systems such as smart-phone ICs and application processors, digital baseband, innovative multimedia ICs, personal e-health ICs, energy-efficient sensor systems.

HIGH-PERFORMANCE DIGITAL — Microprocessors; graphics processors; system-on-chips integrating processor cores, graphics and peripheral controllers; many-core and thread-rich processors; network processors; high-speed digital circuits; intra-chip communication circuits; soft error, variation, and fault-tolerant circuits; reconfigurable logic arrays; security circuits; high-speed CAMs and register files; clock generation and distribution circuits and architectures; high-performance-logic microarchitectures and circuit techniques; implementation methodologies for high-performance digital VLSI; power- and leakage management techniques for high-performance processors and graphics; power-gating circuits; adaptive digital circuits; thermal and wear-out sensors; digital PLLs; integrated DC-DC converters.

IMAGERS, MEMS, MEDICAL & DISPLAY— Image sensors and companion chips; image sensor SoCs; smart sensors; MEMS for analog, RF, and sensor applications; integrated sensors and transducers; organic sensors; sensor-interface circuits; neural interfaces; biosensors, microarrays and lab-on-a-chip; environmental and wearable biomedical electronics; display drivers, controllers, and companion chips; organic LED and liquid-crystal-display interface circuits; flat-panel and projection displays; circuits for print-heads.

MEMORY — Static, dynamic, non-volatile, read-only memory, and content-addressable-memory; memory subsystem and array architectures along with related circuits; memory I/O interface design and circuit techniques, including 3D memory integration; phase-change, magnetic, spin-torque-transfer, ferroelectric, resistive, and other emerging memory designs and architectures; embedded memory architectures and designs, including single- and multi-port cache memory or register files, for computing, consumer electronics, and emerging applications such as biomedical devices; advanced circuit techniques to enable high-performance and low-voltage memory design; advanced architectures and designs to improve memory reliability and fault-tolerance, for example, novel error-correction (ECC) and redundancy schemes; memory controllers and solid-state-disk controllers.

RF — mm-Wave/RF/IF/baseband circuits and sub-systems, both narrowband and wideband, including receiver and transmitter frontends, modulators/demodulators, power amplifiers/detectors, RF switches and integrated antennas/MIMO/phased arrays, frequency generators; circuits for communications, networking, sensing, RADAR, RF imaging, SiP integration and advanced RF applications. Also, circuits that achieve increased frequency range, tunability, selectivity, dynamic range, power efficiency, configurability, silicon scaling, or environmental robustness.

TECHNOLOGY DIRECTIONS —- Advanced circuit technologies and techniques; ultra-low-voltage and sub-threshold logic design; molecular-, organic-, and nanoelectronics; flexible substrates and printable electronics; 3D-integration and novel packaging technologies; compound-semiconductor, superconductive, and micro-photonic technologies and circuits; energy sources and energy harvesting; emerging applications such as biomedical and ambient-intelligence; emerging wireless applications and circuits; advanced signal-processing and microprocessor architectures; design for manufacturability; analog and optical processors, non-transistor-based analog and digital circuits and their system architectures; advanced memory technologies; spintronics; quantum storage; emerging sensor-network concepts such as body-area and body-sensor networks.

WIRELESS — Receivers, transmitters, transceivers, and SoCs, for connectivity, cellular, broadcast, and radar applications including multi-standard and multi-band solutions. Examples include (but are not limited to) WLAN, WiMax, cellular base stations and handsets, GPS, DVB/DMB, UWB, ISM, and mm-wave-band systems. Also, highlyintegrated transceivers for advanced wireless applications targeting sensing, imaging, etc. are encouraged.

WIRELINE— Receivers/transmitters/transceivers for wireline systems; backplane transceivers and chip-to-chip communications. Examples include links for (but not limited to) Ethernet, Fibre Channel, optical/electrical data transfer, PON, advanced serial memory, consumer electronics, SONET, SDH, LAN, WAN, FDDI, xDSL, cable modem, power-line/phone home networks, and subscriber-line circuits and modems. In addition, wireline transceiver building blocks like AGC, equalization circuits, oscillators, PLLs, line-drivers and hybrids, etc. are encouraged.

Submission Deadline is Monday, September 10, 2012 • 3:00PM Eastern Daylight Time (19:00 GMT)

STUDENT INITIATIVES
Graduate students are particularly invited to participate in events that provide an opportunity to showcase both their completed and early work, and exchange experiences with other students and researchers from academia and industry. Beyond participating in the regular paper sessions, there are opportunities in both the Student Research Preview and the Academic Demonstration Session, as well as participating in the ISSCC Silkroad Award competition. (The Silkroad Award is presented to first-time student presenting authors from an emerging region in the Far East.)

Further information including submission procedures, formats, student initiatives and deadlines can be found at http://www.isscc.org