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EOS/ESD Symposium 2014 : 2014 EOS/ESD SYMPOSIUM CALL FOR PAPERS

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Link: http://esda.org/symposiaEOS-ESD.html
 
When Sep 7, 2014 - Sep 12, 2014
Where Westin La Paloma in Tucson, AZ, USA
Submission Deadline Jan 10, 2014
Categories    electronics   electrostatic
 

Call For Papers

The ESD Association is requesting abstracts for technical papers covering the effects of electrostatic discharge (ESD), electrical overstress (EOS), and static electricity for presentation at the 36th Annual EOS/ESD Symposium, September 7-12, 2014 at the Westin La Paloma in Tucson, AZ, USA.

Papers for the EOS/ESD Symposium should deal with work in the following areas: component level EOS/ESD, system level EOS/ESD, EOS/ESD Factory Level and Materials Technology, Electrostatic Control, Magnetic Recording Heads and Ultra-Sensitive Devices, ESD Standards – Components, System, and Factory & Materials.

Paper submissions should include data and analysis that advance state-of-the-art knowledge, enhance or review general knowledge, or address new topics. The technical program committee especially encourages new areas and fields relevant to EOS and ESD.

Submissions must include a 50-word abstract and a four page (maximum) summary of the work. The deadline for submission of abstracts and paper summaries is Friday, January 10, 2014. Late submissions will not be accepted. The final submission deadline for the finished paper is Friday, June 13, 2014. Final papers will be limited to a maximum of 10 pages.

Persons interested in submitting a paper should obtain copies of the Symposium call for papers from the EOS/ESD Association, 7900 Turin Rd., Building 3, Rome, NY 13440; phone: 315-339-6937; fax: 315-339-6793; email: info@esda.org. The call for papers also may be downloaded from the ESD Association’s website,
http://esda.org/Documents/2014%20Call%20for%20papers.pdf
http://esda.org/Documents/2014%20Student%20Call%20for%20papers.pdf

Accepted papers covering selected topics may be considered for review for invited publications in IEEE Transactions on Device and Materials Reliability (TDMR), IEEE Transactions on Electron Devices, the Micro-Electronics Reliability Journal, the Journal of Electrostatics or other appropriate publications.

Students submitting an abstract (first author only) will be eligible for reduced (50% off) Symposium registration fee, and waived fees to all Symposium tutorials.

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