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IEEE Micro Special Series on Harsh Chips

CALL FOR PAPERS
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Guest Editors: Augusto Vega, Alper Buyuktosunoglu, Pradip Bose (IBM)

Submissions due: Jan 17, 2014
Publication date: 2014 - Various

Embedded chips are deployed almost everywhere, from mobile phones to on-board
electronics in automobiles and planetary rovers. Different from conventional
microprocessor designs, the operation conditions of embedded processors are
severely constrained by the environment. For example, Unmanned Aerial Vehicle
(UAV) chips demand significant throughput for real-time processing despite
their tight power budget. To guarantee reliability in such harsh environments,
the design and operation of embedded processors should traverse different
layers, involving firmware, operating system, applications, as well as power
management units and communication interfaces. The goal of this IEEE Micro
series is to seek original papers on topics related to all critical aspects of
new-generation harsh environment-capable embedded processors. This series
will be published over several issues of IEEE Micro.

Areas of interest include, but are not limited to:

- Applications and design issues related to Harsh Chips, e.g.
o AEROSPACE: unmanned aerial vehicles (UAVs), planetary rovers and space
probes, satellites, avionic systems, etc.

o MEDICAL SUPPORT: lifesaving monitors, portable medical devices,
high-end imaging systems, etc.

o OIL AND GAS EXPLORATION & EXTRACTION: unmanned underwater vehicles (UUVs),
measurement while drilling (MWD), logging while drilling (LWD), etc.

o AERIAL SURVEILLANCE

o DISASTER search, rescue, and relief

o NOVEL APPLICATIONS for highly-reliable low-power embedded chips

- Architectural approaches for reliability assurance under low power budgets.
- Availability, soft-error tolerance and recovery issues.
- Highly-reliable cache/memory hierarchies.
- Massive heterogeneous processing capabilities.
- Power management techniques.
- Very-low power, reliable real-time processing.
- Specialized accelerator architectures and unique designs.
- Reusable and/or reconfigurable embedded designs.
- Packaging and cooling.
- Algorithm, application and software-based fault tolerance.
- Cross-stack hardware/software techniques for reliability assurance.


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SUBMISSION PROCEDURE:
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Log onto IEEE CS Manuscript Central (
https://mc.manuscriptcentral.com/micro-cs) and submit your manuscript.
Please direct questions to the IEEE Micro magazine assistant
(micro-ma@computer.org). For the manuscript submission, acceptable
file formats include Microsoft Word and PDF. Manuscripts should not
exceed 5,000 words including references, with each average-size figure
counting as 150 words toward this limit. Please include all figures
and tables, as well as a cover page with author contact information
(name, postal address, phone, fax, and mail address) and a 200-word
abstract. Submitted manuscripts must not have been previously
published or currently submitted for publication elsewhere, and all
manuscripts must be cleared for publication. All previously published
papers must have at least 30% new content compared to any conference
(or other) publication. Accepted articles will be edited for
structure, style, clarity, and readability. For more information,
please visit the IEEE Micro Author Center
(http://www2.computer.org/portal/web/peerreviewmagazines/acmicro)


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QUESTIONS?
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Contact Guest editor, Augusto Vega (ajvega@us.ibm.com)