3rd International Conference on Antennas, Microwave and Microelectronics Engineering (AMiMi 2026)
July 28 ~ 29, 2026, Virtual Conference Scope & Topics 3rd International Conference on Antennas, Microwave and Microelectronics Engineering (AMiMi 2026) will provide an excellent international forum for sharing knowledge andnew research results in all areas of Antennas, Microwave and Microelectronics Engineering. The conference focuses to promote interdisciplinary studies Antennas, Microwave and Microelectronics Engineering.
Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in the following areas, but are not limited to these topics only.
Topics of interest include, but are not limited to, the following Antennas, Propagation and Electromagnetic Engineering
Antenna Technologies
- Antenna Theory, Radiation, and Electromagnetic Modeling
- Microstrip, Printed, Integrated, and On Chip Antennas
- Wideband, Multiband, UWB, and High Efficiency Antennas
- Dielectric Resonator Antennas (DRAs)
- Conformal, Flexible, Wearable, and Textile Antennas
- Reconfigurable, Tunable, and Active Antennas
- MIMO, Massive MIMO, and Holographic MIMO Surfaces
- Phased Arrays and AI Driven Beamforming
- Millimeter Wave, Sub THz, and THz Antennas
- Nano Antennas, Plasmonic and Optical Antennas
- Antenna in Package (AiP) and Antenna on Chip (AoC)
Emerging Paradigms
- Reconfigurable Intelligent Surfaces (RIS) / Intelligent Reflecting Surfaces
- Holographic Beamforming and Continuous Aperture Surfaces
- Electromagnetic Digital Twins for Antennas and Arrays
- AI/ML Native Antenna Synthesis and Generative EM Design
- Antennas for 6G, IoT, UAVs, CubeSats, and Autonomous Systems
- Integrated Antenna Sensor Systems
- Propagation and Channel Modeling
- Channel Modeling for 5G/6G, mmWave, Sub THz, and THz Bands
- Propagation in Complex, Harsh, and Indoor Environments
- Scattering, RCS, and Electromagnetic Wave Interaction with Materials
- Propagation for Joint Communication, Sensing and Localization (JCSL / ISAC)
- Semantic and Goal Oriented Communication Models
Microwave, Millimeter Wave and THz Engineering
- RF, Microwave and mmWave Components
- Passive Components: Filters, Multiplexers, Couplers, Transitions
- Active Components: LNAs, PAs, Mixers, Oscillators
- MMICs, RFICs, and High Frequency Integrated Components
- RF MEMS, NEMS, and Micro Machined RF Devices
- Novel Waveguides, SIW, and On Chip Transmission Lines
- Sub THz CMOS and SiGe RFICs (140–300+ GHz)
- High Power mmWave and THz Devices
- RF Packaging, Heterogeneous Integration and Chiplet Based RF Systems
Advanced RF and Microwave Systems
- Microwave and mmWave Communication and Sensing Systems
- THz Sources, Detectors, and Imaging Systems
- Microwave Photonics and Photonic RF Integration
- Software Defined Radio (SDR) and Digital RF Architectures
- AI Enabled RF System Design and Optimization
- Signal Integrity, EMI/EMC, and High Speed Interconnects
- RF Interconnects for AI Accelerators and Chip to Chip Wireless Links
Radar and Sensing
- Radar Systems, SAR, Automotive Radar, and Imaging Radar
- Integrated Sensing and Communication (ISAC) Chipsets
- Remote Sensing for Climate, Environment, and Security
- Electromagnetic Imaging and Inverse Scattering
Applied Electromagnetics and Computational Techniques
- Computational Electromagnetics (CEM) and Numerical Methods
- Physics Informed Neural Networks (PINNs) for EM Simulation
- Foundation Models and Generative AI for EM Design
- Metamaterials, Metasurfaces, FSS, and EBG Structures
- Metasurface Based Analog Computing (EM Computing)
- Electromagnetic Materials and Novel Media
- Bio Electromagnetics and RF Exposure Modeling
- Electromagnetic Compatibility (EMC) and Interference Mitigation
- EM Digital Twins for RF, Antennas and Propagation
Microelectronics, VLSI and Semiconductor Technologies
- Semiconductor Devices and Fabrication
- CMOS, FinFET, GAAFET, and Beyond CMOS Devices
- Device Modeling, Simulation, and Reliability
- 2D Material Devices (MoS₂, WS₂, Graphene)
- CNTFETs, TFETs, and Emerging Nano Devices
- 3D Monolithic Integration (3D IC)
- Heterogeneous Integration with Photonics and Co Packaged Optics (CPO)
- Cryogenic Electronics (Cryo CMOS) for Quantum Computing
- Advanced Lithography, Nanofabrication, and 3D Integration
- Organic, Flexible, and Wearable Electronics
Circuits and Systems
- Analog, RF, and Mixed Signal ICs
- Low Power and Energy Efficient VLSI
- High Speed Digital and SerDes Circuits
- System on Chip (SoC), Lab on Chip, and Heterogeneous Integration
- Memory Technologies: SRAM, DRAM, MRAM, ReRAM, FeFET
- AI Accelerators and Hardware for Generative AI
- Neuromorphic Computing and In Memory Computing (IMC)
- In Sensor Computing and Edge Intelligence
Design Automation and Hardware Security
- EDA Tools, Mixed Domain Simulation, and Co Design
- Logic, Architectural, and System Level Synthesis
- Hardware Security, PUFs, and Side Channel Attack Mitigation
- Testing, Design for Testability (DFT), and Reliability Engineering
Sensors and Microsystems
- MEMS/NEMS Sensors and Actuators
- RF MEMS for 5G/6G and High Frequency Systems
- Micro Sensors for Biomedical, Environmental, and Industrial Applications
- Bio Integrated RF Systems and Wireless Neural Interfaces
Wireless Communication Systems and Emerging Technologies
5G/6G Wireless Systems and Architectures
- Spectrum Above 100 GHz and Sub THz Communications
- IoT, Massive IoT, and Low Power Networks
- UAV to Everything (U2X) and Aerial Networks
- Non Terrestrial Networks (NTN): Satellite to Phone, HAPS, Inter Satellite Links
- RFID, NFC, Wireless Power Transfer, and Energy Harvesting
- Far Field and mmWave Wireless Power Transfer (WPT 2.0)
- AI Enabled Wireless Networks and Resource Optimization
- Semantic and Goal Oriented Communications
- Integrated Localization, Mapping and Communication (JCSL)
- Wireless for Robotics, Autonomous Systems and RF Based Perception
Sustainability, Security and Cross Disciplinary Innovations
- Green RF, Sustainable Electronics and Low Carbon Semiconductor Processes
- Secure RF Systems and EM Side Channel Attack Mitigation
- Hardware Trojans and Secure IC Design
- Circular Electronics Manufacturing
- Bio Compatible RF Materials and Implantable Systems
Paper Submission Authors are invited to submit papers through the conference Submission System by May 24, 2026 . Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by The proceedings of the conference will be published by International Journal on Cybernetics & Informatics (IJCI) series (Confirmed). Selected papers from AMiMi 2026, after further revisions, will be published in the special issue of the following journals. Important Dates | Submission Deadline | : | May 24, 2026 | | Authors Notification | : | June 27, 2026 | | Final Manuscript Due | : | July 04, 2026 |
Co - Located Event ***** The invited talk proposals can be submitted to amimi@amimi2026.org
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