10th International Conference on Electrical and Electronics Engineering (EEEN 2026)
July 29 ~ 30, 2026, Virtual Conference Hybrid -- Registered authors can present their work online or face to face. Scope & Topics 10th International Conference on Electrical and Electronics Engineering (EEEN 2026) marks a significant milestone in bringing together global researchers, innovators and industry practitioners to exchange knowledge, present breakthroughs and explore emerging trends across the rapidly evolving landscape of Electrical, Electronics, Instrumentation and Communication Engineering. Over the past decade, EEEN has established itself as a vibrant forum for advancing foundational theories, pioneering technologies and transformative applications that shape modern engineering systems.
EEEN 2026 continues this tradition by providing a premier platform for showcasingoriginal research contributions, cutting edge developments and state of the art reviews spanning both established and emerging domains. The conference aims to foster interdisciplinary collaboration, stimulate new ideas and accelerate innovation in areas such as advanced semiconductor technologies, intelligent systems, power and energy engineering, next generation communication networks, robotics, embedded systems and biomedical technologies.
Researchers, academicians, industry experts and practitioners are encouraged to submit high quality papers that advance theory, enhance practice, or bridge the gap between research and real world applications.
Topics of interest include, but are not limited to, the following Next Generation Electronics, Devices and Materials
- Advanced Semiconductor Devices
- VLSI, 3D ICs and Heterogeneous Integration
- Advanced Packaging andChiplet Architectures
- Nanoelectronics and Quantum Devices
- Silicon Photonics and Optoelectronics
- Flexible, Wearable and Bio Integrated Electronics
Power Electronics, Energy Systems and Sustainability
- Power Electronics and Integrated Power Modules
- Electric Vehicles, Charging and Transportation Electrification
- Smart Grids, Microgridsand DER Integration
- Energy Storage, Battery Systems and Digital Twins
- High Voltage Engineering and Protection
- Sustainable and Carbon Aware Energy Systems
AI, Computing Systems and Intelligent Hardware
- AI Hardware Acceleration
- AI Driven Electronic Design Automation (AI EDA)
- Generative AI for Engineering and System Design
- Edge AI, TinyMLand Low Power Intelligence
- High Performance and Cloud Scale Computing
- Bio Inspired and Neuromorphic Computing
- Secure and Trusted Hardware
- Sustainable and Green Computing
Signal Processing, Machine Learning and Data Intelligence
- Advanced Signal, Image and Speech Processing
- ML/AI for Engineering Systems
- Optimization, Metaheuristics and Intelligent Algorithms
- Data Fusion, Multimodal Analytics and Digital Twins
Communication Systems, Networks and 6G Technologies
- 6G and Beyond Wireless Systems
- AI Native Wireless Networks
- Joint Communication and Sensing (JCAS / ISAC)
- RF, mmWaveand THz Circuits
- Optical Communication and Photonic Networks
- Satellite, UAV and Space Communications
Cybersecurity, Networks and Information Systems
- Network Security and Privacy
- Cybersecurity for Embedded and CPS
- Secure Federated Learning and Distributed AI
- Resilient Network Architectures
Robotics, Automation and Cyber Physical Systems
- Autonomous Robotics and Intelligent Systems
- Cyber Physical Systems and Digital Twins
- AI Driven Robotics Simulation and Control
- Advanced Control Systems
- Human–Robot Interaction
- Mechatronics and Avionics
Sensing, Instrumentation and Embedded Systems
- Smart Sensors andIoT Systems
- Embedded and Real Time Systems
- Remote Sensing and Geospatial Intelligence
- Quantum Sensing and Precision Measurement
- Space Electronics and Radiation Hardened Systems
Biomedical Engineering and Healthcare Technologies
- Biomedical Signal and Image Processing
- Wearable, Implantable and Assistive Devices
- Neural Engineering and Brain–Machine Interfaces
- AI Enabled Healthcare and Digital Medicine
Bioinformatics and Computational Biology
- Electromagnetics, Thermal Management and Emerging Interdisciplinary Areas
- Electromagnetic Compatibility and Interference
- Thermal Management, Cooling and Reliability
- Quantum Communication and Computing
- Electro Optic Co Design
Paper Submission Authors are invited to submit papers through the conference Submission System by June 08, 2026 . Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by Emerging Trends in Electrical, Electronics & Instrumentation Engineering: An International Journal (EEIEJ)series (Confirmed). Selected papers from EEEN 2026, after further revisions, will be published in the special issue of the following journals. Important Dates | Submission Deadline | : | June 08, 2026 | | Authors Notification | : | July 15, 2026 | | Final Manuscript Due | : | July 22, 2026 |
Co - Located Event ***** The invited talk proposals can be submitted to eeen@eeen2026.org |
