ABOUT EPTC
The 15th Electronics Packaging Technology Conference (EPTC 2013) is an International event organized by the IEEE Reliability/CPMT/ED Singapore Chapter and sponsored by IEEE CPMT Society. EPTC 2013 will feature technical sessions, short courses/forums, an exhibition, social and networking activities. It aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field. Since its inauguration in 1997, EPTC has developed into a highly reputed electronics packaging conference in Asia and is well attended by experts in all aspects related to packaging technology from all over the world.

CONFERENCE TOPICS You are invited to submit an abstract, presenting new development in the following categories:
 Advanced Packaging: Flip-chip and wire-bond packaging, embedded passives and actives on substrates, 3D System in Packaging, etc.
 TSV/Wafer Level Packaging: Wafer level packaging, embedded chip packaging, 3D integration, TSV, Silicon interposer, RDL, bumping technologies, etc.
 Interconnection Technologies: Wire-bond technology, Flip-chip technology, solder alternatives (ICP, ACP, ACF, NCP), die attachment (Pb-free), etc.
 Emerging Technologies: Packaging technologies for MEMS, biomedical, optoelectronics, photo voltaic, printed electronics, wearable electronics, etc.
 Materials & Processes: Materials and processes for traditional and advanced microelectronic systems, MEMS, solar, green and biomedical packaging.
 Electrical Modeling & Simulations: Power plane modeling, signal integrity analysis of substrate/package.
 Mechanical Modeling & Simulations: Thermo-mechanical, moisture, fracture, fatigue, vibration, and drop impact modeling, Chip-package interaction, etc.
 Thermal Characterization & Cooling Solutions: Thermal modeling and simulation, component and system level thermal management and characterization
 Quality & Reliability: Component, board and system level reliability assessment, Interfacial adhesion, accelerated testing, failure characterization, etc.
 Wafer/Package Testing & Characterization: High-speed test architectures and systems design, test methodologies, probe card design, package-test interaction, high-throughput testing etc.

IMPORTANT DATES
Online abstract submission start
14th April 2013
Closing of abstract submission
7th June 2013
Notification of acceptance
6th August 2013
Submission of manuscript
30th September 2013

ABSTRACT AND PAPER SUBMISSION
Abstracts are solicited to describe original and unpublished work. The abstract should be at least 500 words and it must clearly state the purpose, methodology, results (including data, drawings, graphs and photographs) and conclusion of the work. Key references to prior publications and how the work enhances existing knowledge should be included in the abstract as well. Authors can choose between oral or poster presentation.
Authors must designate two appropriate categories (found under CONFERENCE TOPICS) for abstract review. All submissions must be in English and should be made via the online submission system found at http://www.eptc-ieee.net. The required file format is Adobe Acrobat PDF or MS Word in one single file for each submission. The abstracts must be received by 7th June, 2013. Authors must include their affiliation, mailing address, telephone and fax numbers, and email address. Authors will be notified of paper acceptance and publication instruction by 6th August 2013. The final manuscript for publication in the conference proceedings is due by 30th September 2013. The conference proceeding is an official IEEE publication and accepted paper will be available in IEEE Xplore.

OUTSTANDING TECHNICAL PAPERS Author(s) of Best Technical Paper (ORAL/POSTER), Outstanding Technical Paper (ORAL) and Best Student Paper will receive an award at the next conference.

CALL FOR SHORT COURSES
The conference program includes short courses, which will be conducted by leading experts in the field. Details will be updated in the conference website and available in subsequent mailings. Proposals for short courses can be submitted to techchair@eptc-ieee.net

CALL FOR EXHIBITION/SPONSORSHIP PARTICIPATION
A tabletop exhibition featuring suppliers of materials, equipment, software and service providers of microelectronics and electronic assembly industries, will be held during the conference. Potential exhibitors and sponsors may email eptc2013.secretariat@atenga.sg for details.

Organized by
IEEE Reliability/CPMT/ED Singapore Chapter

Sponsored by
IEEE COMPONENTS, PACKAGING AND
MANUFACTURING TECHNOLOGY SOCIETY

General Chair
Mr. Ashok ANAND, Singapore
Technical Chair
Mr. Alfred YEO, Infineon
Program Chair
Mr. CHONG Chin Hui, Micron

EPTC 2013: website: http://www.eptc-ieee.net
Email: eptc2013.secretariat@atenga.sg
Join us on: Linkedin [EPTC OC]
Follow us on: Twitter [EPTC (@EPTCOC)]