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CBD 2023 : The Eleventh International Conference on Advanced Cloud and Big Data | |||||||||||||||
Link: https://www.cbd-conference.net/2023/ | |||||||||||||||
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Call For Papers | |||||||||||||||
The International Conference on Advanced Cloud and Big Data (CBD) provides a forum for both academics and practitioners working on cloud computing and big data technologies to explore new ideas, share their experiences and leverage each other’s perspectives. Besides the latest research achievements, this conference also covers cloud/big data industry practices and their broad applications, and gives all participants a chance to identify the new emerging “hot” trends in these areas. We solicit original papers on a wide range of cloud computing and big data topics that can be divided into three tracks but are not limited to:
1. Research Track -Cloud Security and Privacy -Cloud Data Center Networking -Cloud Virtualization -Cloud Storage -Multi/Hybrid/Inter Cloud -Big Data Processing/Mining/Query -Big Data Security and Privacy -Edge Computing and its Applications -Deep Learning/Federated Learning -Cloud and Big data Management -Blockchain and its Applications -Social Network -Edge Computing Architecture and Algorithm -Machine Learning and AI at Edge 2. Industry Track -Cloud Computing Solutions -Cloud Specifications/Standards -Cloud and Big Data in Industry -Big Data in Smart City/Home -Edge Computing Solutions -Blockchain Solutions 3. Application Track -Cloud based Industrial Internet -Edge-based Industrial Internet -Mobile Edge Computing -Machine/Deep Learning Applications -Social Networking -Knowledge Graph -Blockchain Applications ----------------------- Paper Submission ----------------------- Submitted manuscripts must be formatted in standard IEEE US Letter Format: http://www.ieee.org/conferences_events/conferences/ publishing/templates.html and must be submitted via EasyChair (https://easychair.org/conferences/?conf=cbd2023) as PDF files. The review version is limited to 6 pages (IEEE proceedings format), including references and illustrations. Submitted papers should not be previously published in or be under consideration for publication in another conference or journal. Submission of a paper should be regarded as an undertaking that, should the paper be accepted, at least one of the authors will attend the conference to present the paper. ----------------------------------------- General Chairs ----------------------------------------- -Laurence T. Yang, Hainan Univ., China -Yongduan Song, Chongqing Univ., China -Mohammad S. Obaidat, Univ. of Jordan, Jordan ----------------------------------------- Program Chairs ----------------------------------------- -Hai Jiang, Arkansas State Univ., USA -Fang Dong, Southeast Univ., China -Mohammad M. Hassan, King Saud Univ., KSA ----------------------------------------- Executive Chairs ----------------------------------------- -Zhi Zhou, Sun Yat-sen Univ., China -Yuan Gao, Hainan Univ., China -Jing Yang, Hainan Univ., China ----------------------------------------- Publicity Chairs ----------------------------------------- -Runqun Xiong, Southeast Univ., China -Youqi Li, Beijing Inst. of Tech., China -Chi Zhou, Shenzhen Univ., China ----------------------------------------- Publication Chairs ----------------------------------------- -Jinghui Zhang, Southeast Univ., China -He Chen, Tsinghua Univ. Press, China -Shengxin Dai, Sichuan Univ., China ----------------------------------------- Web Chairs ----------------------------------------- -Jiawei Wang, The Univ. of Warwick, UK -Na Song, Hainan Univ., China ----------------------------------------- Steering Chairs ----------------------------------------- -Laurence T. Yang, Hainan Univ., China -Junzhou Luo, Southeast Univ., China -Yi Pan, Shenzhen Inst. of Adv. Tech., CAS, China ----------------------------------------- Organized by ----------------------------------------- -Hainan Univ., China -Southeast Univ., China ----------------------------------------- Co-Sponsored by ----------------------------------------- -ACM Nanjing Chap. -ACM SIGCOMM China -Tsinghua Sci. and Tech. -Jiangsu Comp. Soc. |
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