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ICACCE- 2014 : International Conference on Advances in Computing and Communication Engineering (ICACCE- 2014)

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Link: http://www.kecua.ac.in/icacce14
 
When Feb 22, 2014 - Feb 23, 2014
Where Dwarahat
Submission Deadline Jan 5, 2014
Notification Due Jan 20, 2014
Final Version Due Jan 28, 2014
Categories    mobile ad-hoc and sensor netwo   security, privacy and trust   big data analytics   smart grids
 

Call For Papers

The First International Conference on Advances in Computing and Communication (ICACC- 2014) will be held at Bipin Tripathi Kumaon Institute of Technology, Dwarahat on February 22-23, 2014. We are hosting this conference under IEEE BTKIT Student Branch, BTKIT ACM Student Chapter and Uttarakhand ACM Professional Chapter. The two-day conference will include invited keynote and oral presentations. ICACC 2014 will provide a forum for researchers and engineers in both academia and industry to exchange the latest innovations and research advancements in Innovative Computing, Communication and Engineering. ICACCE 2014 also provides the attendees the chances to identify the emerging research topics, as well as the future development directions. Prospective authors are invited to submit full (original) research papers; which are NOT submitted or published or under consideration anywhere in other conferences or journals.
Important Dates:
Last Date for Paper Submission: Jan 5, 2014
Intimation of Acceptance: Jan 20, 2014
Paper Registration Deadline: Jan 28, 2014

Track 1: Computer Science & Information Systems
Mobile Ad-hoc and Sensor Network
Security, Privacy and Trust
Natural Language Processing
Parallel/Distributed Algorithm and Architecture
Distributed Database and Data Mining
Machine Learning/Artificial Intelligence/ Human-computer Interaction
Big Data Analytics
E-Learning, E-Commerce, E-Society, etc

Track 2: Electrical & ElectronicsEngineering
Power Electronics & Drives
Smart Grids
Renewable Energy Sources
Embedded Applications
Wireless Communication
Personal Communication System
VLSI Design and Fabrication
Photonic Technologies
Digital Signal Processing
Telecommunication Services and Applications
Optical Networks

Advisory Committee
Dr. Gulshan Rai, Director General, CERT, Government of India
Dr. B K Gairola, Director General, NIC, Government of India
Prof. D. S. Chauhan, Vice Chancellor, GLA University, India
Prof. M.S. Vyas, Vice Chancellor, RTU, Kota, India
Prof. P.B. Sharma, Vice Chancellor, DTU, Delhi, India
Prof. P J Narayanan, Chair, ACM India Council, India
Prof. Vijay Kumar, University of Missouri-Kansas City, USA
Prof. Rakesh Verma, University of Houston, USA
Prof. Tarek N. Saadawi, The City College of the City University of New York, USA
Prof. S. K. Madria, Missouri University of Science & Technology, USA
Prof. Deepak Garg, Chair, IEEE Computer Society, India Council
Prof. Durgesh Pant, Director, School of Computing, UoU, India
Prof. K. S. Verma, Director, KNIT, Sultanpur, India
Prof. N. K. Joshi, Director, College of Engineering, TMU, Moradabad, India
Prof. Lalit Awasthi, Director, AVB Institute of Technology, HP, India
Prof. Narottam Chand, National Institute of Technology, Hamirpur, HP

Technical Program Committee
Prof. M. P. Singh, Former Dean, GBPUAT Pantnagar, India
Prof. B.S. Bisht, Former Vice Chancellor, GBPUAT Pantnagar, India
Prof. VPS Arora, Former Vice Chancellor, Kumaon University, Nainital, India
Prof. B.K Singh, Director, Seemant Insititute of Technology, Pithoragarh
Prof. S. K. Goyal, Director, WIT, Dehradun, India
Prof. Dharminder Kumar, Dean, Faculty of Engineering, GJU, Hissar, India
Prof. D K Joshi, Amravati Vidyapeeth, Amravati, India
Prof. Chittranjan Hota, Bits-Pilani Hyderabad, India
Prof. K. V. Arya, ABV IIIT, Gwalior, India
Prof. RK Sharma, Thapar University, Patiala, India
Prof. Amit Saxena, GGU, Bilaspur, India
Dr. Anurag Avashthi, Former Vice President, Bharti Telesoft, India
Prof. Basheer Al-Duwairi, Jordan University of Science and Technology, Jordan
Prof. Carsten Schürmann, IT University of Copenhagen, Denmark
Dr. Zia Saquib, C-DAC Mumbai, India
Dr. Bilal Khan, University of California, Los Angeles, USA
Dr. Naveen Chauhan, National Insititute of Technology, Hamirpur, HP
Dr. T. A. Usmani, Oman
Dr. Shailendra Fuloria, ABB, India
Navneet Aggarwal, TCS, India
Devendra Durgapal, Vmware


Patron
Dr. D.S Pundhir
Chair
Dr. R. S Prasad
Co-Chair
Dr. Jyoti Saxena, Dean (R& D)
Dr. Satendra Singh, Dean (Academics)
Convener
Dr. Kunwar Singh Vaisla
Co- Convener
Dr. Ajit Singh, CSE Deptt
Vishal Kumar, CSE Deptt
Organizing Secretary
Dr. Rajendra Kumar Bharti, CSE Deptt
Lalit Garia, ECE Deptt
Organizing Committee
Amit Paul, CSE Deptt
Ramesh Chandra Belwal, CSE Deptt
Dr. Vinod Mishra, CSE Deptt
Archana Verma, CSE Deptt
Swati Verma, CSE Deptt
Sachin Gaur, CSE Deptt
Rachna Arya, ECE Deptt
Varun Kakar, ECE Deptt
R.P Singh, ECE Deptt
Bhawana Parihar, CSE Deptt
Parul Kansal, ECE Deptt

Sponsorship Categories
This conference will provide a platform to industries /organizations to advertise their products/ services/ technologies etc. There can be exhibits / stalls etc. from the sponsors of the conference. Sponsorship can be provided in the following categories:
Main Sponsor:
INR 50,000/- and above : Person Nominated by Organization would be elected as Distinguished Guest+ Display of organization and their logo in each advertisement of Conference+ Five delegates without Registration Fee + 5 stalls for exhibition + 4 page advertisement in the conference proceedings + promo material to be put in the conference kit.
Platinum Sponsor:
INR 25000/- and above : Three delegates without Registration Fee + three stalls for exhibition + two page advertisement in the conference proceedings + promotional material to be put in the conference kit.
Gold Sponsor:
INR 15000/-: Two delegates without Registration Fee + two stalls for exhibition + full page advertisement in the conference proceedings + promotional material to be put in the conference kit.
Silver Sponsor:
INR 10000/-: One delegate without Registration Fee + one stall for exhibition + half page advertisement in the conference proceedings + promotional material to be put in the conference kit.

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