ESTC 2010 : IEEE-CPMT Electronics System Integration Technology Conference

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ESTC 2010 : IEEE-CPMT Electronics System Integration Technology Conference

Link: http://www.estc-2010.de

When	Sep 13, 2010 - Sep 16, 2010
Where	Berlin, Germany
Submission Deadline	Feb 1, 2010
Notification Due	Apr 1, 2010
Final Version Due	Jun 1, 2010

Categories packaging microelectronics system integration

Call For Papers

ESTC 2010 seeks original papers describing research in all areas of electronic packaging. Papers may be submitted to the following tracks:

Advanced packaging
Microsystem packaging
New materials and processes
Optoelectronics
Assembly and manufacturing technology
Modelling and simulation
Applied reliability
Power electronics
Electrical design and modelling
Emerging technologies

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