The 2017 European Microelectronics and Packaging Conference (EMPC) will be held for the first time in Poland, at
Warsaw University of Technology on September 10 - 13, 2017. The conference will include a plenary session, parallel symposia and will be accompanied by thematic exhibition.

ABSTRACTS ARE BEING REQUESTED IN THE FOLLOWING AREAS:

- Advanced packaging and interconnects
- Electronics components assembly and PCB solutions
- Materials and processes
- Printed, hybrid and flexible electronics
- Modeling, design test & reliability
- Functional systems (actuators, sensors, photovoltaics and related)

All submitted abstracts must represent original, previously unpublished work.
We look forward to welcome you to an inspiring and stimulating event.