CALL FOR PAPERS – MOBISLICE III – Mobility Support in Slice-based network control for heterogeneous environments

DESCRIPTION

Network slicing has been standing as one of the key enabling technologies for the upcoming 5th Generation of Telecommunications. Alongside other important technologies, such as NFV, SDN and MEC, its contributions to isolated network provisioning in a more dynamic and flexible way are being pursued in different industry and academia arenas throughout the world. Nonetheless, considering the wide range of foreseen enhanced use cases (not only in scope of 5G but also Beyond-5G), slicing aspects have been mostly targeting either enhancements at the radio level, or the integration of cloud resourcing capabilities for supporting network operation at the core and/or the edge. As such, there is a wide gap related with the impact that such slicing-based procedures will exert over mobility management processes for seamless mobility support while the devices, network or services move both physically (i.e., change their network point of attachment) as well as virtually (i.e., between slices). MOBISLICE III will focus on bringing forth first assessments, technical planning and supportive technologies evolutions, for the validation of network slice deployments in real and experimental scenarios within and outside the lab. It will look deep into on-going research and industrial efforts not only featuring ICT players (e.g., telcos, system providers, vendors) but also verticals (as the network slice consumers), which are pursuing joint technical solutions where the mobility of slices has a presence. Additionally, it will also look at the underlying technical innovations and tools over existing experimental infrastructure, to support these real experiments, trials, laboratorial work and scalability models/assessment.

MOBISLICE III is held in conjunction with the VI IEEE Conference on Network Function Virtualization and Software Defined Networks which will be remote, but originally planned to be in Madrid, Spain, November 10-12 2020.

TOPICS

The MOBISLICE III workshop focuses, but is not limited to, the following topics targeting slicing:

• Vertical use cases and architectures for MOBISLICE
o Slices in constrained environments (IoT, Edge, etc.)
o Automotive service and ITS scenarios
o Telco Operator and enterprise-based environments
o Smart-X slice mobility
o Reliability and security
o Experimental and real trials

• Management and orchestration for MOBISLICE
o Common operations and API
o Inter- and intra-slice mobility
o Lifecycle management
o Heterogeneous access convergence
o High availability and reliability techniques
o Experimental and real trials

• Standardization trends and activities for MOBISLICE
o Status and progresses in 3GPP/ETSI/IETF/5GAA and other SDOs
o Proposals and standardization direction for advanced slicing
o SDN/NFV initiatives
o Slice-enhanced Networking and telecommunication protocols
o Experimental and real trials

• Beyond-5G slicing
o Disruptive architectures
o Zero-touch slice performance
o Experimental and real trials

SUBMISSIONS

MOBISLICE III will accept papers formatted as the standard IEEE double-column conference template, with a 6 page limit, allowing 1 additional page with an additional charge. The best paper voted by the TPC will receive A BEST PAPER award.
Selected papers will be featured in a Special Issue of the “Internet Technology Letters” (John Wiley & Sons)
Check for more submission information at the workshop’s website: http://mobislice.com
Or directly go through to the EDAS Submission Link: https://edas.info/N27695

IMPORTANT DATES

Paper submission: August 24, 2020
Notification of Acceptance: September 28, 2020
Camera-ready Submission: October 19, 2020

TECHNICAL PROGRAMME COMMITTEE

Alex Galis (UCL)
Antonio de la Oliva (UC3M)
Billy Pinheiro (Amachains)
Carlos Bernardos (UC3M)
David Moura (CTEx)
Diego Lopez (Telefonica)
Dirk Trossen (InterDigital)
Fabio Berdi (UFSCar)
Fernando Farias (RNP)
Francesco Tusa (UCL)
Francisco Fontes (Altice Labs)
Gino Carrozzo (Nextworks)
Javier Baliosian (UdelaR)
Joan Serrat (UPC)
John Kaippallimalil (Huawei USA)
Juhoon Kim (Deutsche Telekom)
Kashif Mahmood (Telenor)
Kay Hansge (InterDigital)
Marco Liebsch (NEC)
Paulo Ditarso Maciel (IFPB)
Ramon Casellas (CTTC)
Riccardo Trivisonno (Huawei)
Sri Gundavelli (Cisco)
Tarik Taleb (Aalto University)
Pankaj Thorat (Samsung)
Younghan Kim (Soongsil University)

WORKSHOP CHAIRS

Dr. Daniel Corujo (University of Aveiro and Instituto de Telecomunicações, Portugal)
Prof. Dr. Augusto Neto (Federal University of Rio Grande do Norte, Brazil)
Dr. Seil Jeon (Huawei Technologies, Sweden)

LOCAL WORKSHOP CHAIRS

Prof. Dr. Carlos Bernardos (Universidad Carlos III de Madrid, Spain)
Prof. Dr. Antonio de la Oliva, (Universidad Carlos III de Madrid, Spain)
Luís Contreras Murillo, Telefónica, Spain