As a premier Asia Symposium, ASQED’10 accepts and promotes papers related to circuit and system design (digital, analog, RF, and mixed-signal), semiconductor manufacturing, advanced IC Packaging, Test, Electronic Design Automation (EDA), as well as emerging semiconductor nano/bio-technologies, and photovoltaic electronics. Topics of interest for paper submission are as follows:

• Circuit & System Design • Test & Verification
• IC Packaging Technology
• PCB and PWB Technology & Manufacturing
• Semiconductor & Nano Technology
• Bio Electronics Innovations
• Photovoltaic Technology & Manufacturing
• Electronic Design Automation Methodologies
• Micro-Electro-Mechanical System (MEMS)

Submission of Papers

Paper submission must be done on-line through the conference web site at https://www.softconf.com/a/asqed2010. The guidelines for the final paper format are provided on the symposium website. Authors should submit FULL-LENGTH, original, unpublished papers (Minimum 4, maximum 10 pages) along with abstract of about 200 words. To permit a blind review, do not include name(s) or affliation(s) of the author(s) on the manuscript and abstract. The complete contact author information needs to be entered separately. Please check the as-printed appearance of your paper before sending your paper. In case of any problems, email asqed2010@isqed-asia.org. Please note the following important dates:

Paper Submission Deadline March 16, 2010
Acceptance Notification April 24, 2010
Final Camera-Ready paper June 2, 2010