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3d-ims 2010 : 2nd International Conference on 3D-Imaging of Materials and Systems | |||||||||||
Link: http://www.icmcb-bordeaux.cnrs.fr/3d-ims2010 | |||||||||||
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Call For Papers | |||||||||||
Recent advances in high-resolution 3D-imaging techniques significantly modified the vision we have on materials and systems. Micro structural characterisations of materials as diverse as polymers, ceramics, metals, composites, foams and cellular materials, concrete, rocks, wood, etc are now possible at micro- and nanometre scales in 3D within the volumes. Studying the evolution of systems such as electronic devices submitted to thermal cycling is also greatly modified by the fact that non-destructive 3D-imaging techniques permit to follow a single sample during its complete life cycle. The new possibilities offered in the exploration of the relation between microscopic structure and macroscopic properties are creating new demands in terms of analysis and modelling. The development of reliable and effective laboratory equipment and the increase of computational power lead to a noticeable diffusion of those techniques in both academic and industrial laboratories where a large variety of materials and systems are being studied. The proposed conference aims at gathering experts in 3D image acquisition, 3D image analysis and 3D image applications, in order to exchange experiences in those different fields and improve the quality of the final results that can be obtained. Sessions will cover all the different topics related to data acquisition, data analysis and applications for which the 3D character of the results improves the knowledge of a specific material or system. 3D-IMS2010 is the second conference of a series initiated by 3D-IMS2008 in September 2008 at Carcans (also near Bordeaux). The success of this first edition (more than 110 participants, intense scientific exchanges, very friendly atmosphere) convince us to reconvene two years after, having yet in mind to leave the Bordeaux region for the third edition (to be announced during the conference). |
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