Photonic Integrated Chips (PICs) are set to experience explosive growth in 2025, emerging as the core technology driving innovations in quantum computing, LiDAR, high-speed communications, and biosensing. The global market size is projected to reach $30 billion, with China accounting for 35% of the market. Data center optical modules contribute to over 60% of the PIC demand, while the penetration rate of PICs in solid-state LiDAR soars to 75%. AR glasses are also widely adopting miniaturized PIC modules, with an estimated annual shipment volume of over 50 million units.

However, conventional silicon photonics applications face several critical challenges, such as low tolerable optical power, high optical transmission loss, poor thermal stability, and inability to operate in the visible light spectrum. Silicon nitride (SiN) has become the key to breaking through these limitations, thanks to its ultra-low loss, high optical damage threshold, broad spectral coverage, compatibility with CMOS production lines, and moderate refractive index that facilitates heterogeneous integration with other photonic materials (such as TFLN thin-film lithium niobate, BTO, and InGaAs for photodetectors). These advantages pave the way for large-scale commercialization of high-performance, high-yield, and cost-effective silicon photonics.

Live Broadcast Details:
- Date and Time: Thursday, July 10, 19:30-20:30
- Topic:LIGENTEC's Low-Loss Silicon Nitride PICs and Active Integration
- Speaker: Can Yao, who holds a Bachelor's degree from Tsinghua University, a Master's degree from the Graduate University of the Chinese Academy of Sciences, and a Ph.D. in Photonics from the Institute of Photonic Sciences (ICFO) in Barcelona, Spain. From 2014 to 2020, he conducted research in the field of fiber lasers and fiber sensing at the Swiss Federal Institute of Technology in Lausanne and coordinated the European large-scale innovative talent training project FINESSE. Since 2021, he has been serving as an Application Engineer and Business Development Manager for China at LIGENTEC SA, dedicated to promoting the widespread application of silicon nitride photonic integrated circuits in both scientific frontiers and the industrial sector.

Watch the live broadcast：https://iertuhvzb.vzan.com/live/page/989373893?shauid=RA7PDY8JHMuYWpnGKNq-UA**&vprid=0&sharetstamp=1750820350259


Global Leader in Silicon Nitride PIC Technology—Top Experts from Switzerland's LIGENTEC will delve into:
- How five major technological breakthroughs—waveguide loss below 0.1dB/m, power tolerance exceeding 1W, a wide transparency window from 400nm to 4000nm, 8-inch CMOS wafer process, and active heterogeneous integration modules of lithium niobate on passive silicon nitride for electro-optic modulation or PD detectors—empower application innovations, including:
- Cost reduction and efficiency improvement for LiDAR;
- Expansion and acceleration of data communication capacity;
- High-fidelity transmission for quantum computing;
- Enhanced precision and portability of precision measurement instruments.

Suitable for the following audience:
- LiDAR: System architects, optical engineers, and automotive intelligent driving technicians
- Data Communication: Optical module technology experts, data center architects, and telecom standards experts
- Quantum Computing:Quantum hardware managers and optical platform researchers
- Precision Measurement: High-end instrument R&D and industrial inspection solution experts
- Research Institutions and Universities: Experts, professors, graduate students, and undergraduate students in optics-related fields

Reserve your seat now for the free online seminar and receive the latest LIGENTEC silicon nitride chip application and paper collection. (Participate in the live broadcast interaction for a chance to win a LIGENTEC sports sun hat; if you don't book in advance, watching the live broadcast replay will cost $19.9)




About LIGENTEC:

LIGENTEC is committed to realizing ultra-low loss, small size, and low-cost silicon nitride PIC foundry services. The company mainly operates in low-loss silicon nitride PIC foundry services, which include on-chip transmission loss and end-face coupling loss, with on-chip transmission loss as low as 0.1dB/m. For different working wavelengths and application directions, LIGENTEC provides silicon nitride with thicknesses of 150, 350, and 800nm, and also offers custom processing services for other thicknesses of silicon nitride optical circuits. LIGENTEC provides a complete PDK to facilitate your chip design.