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ELEE 2026 : 5th International Conference on Electrical Engineering

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Link: https://asoft2026.org/elee/index
 
When Oct 17, 2026 - Oct 18, 2026
Where Sydney, Australia
Submission Deadline Sep 5, 2026
Notification Due Sep 29, 2026
Final Version Due Oct 6, 2026
Categories    electrical engineering   bio informatics   robotics   soft computing
 

Call For Papers

5th International Conference on Electrical Engineering (ELEE 2026)

October 17 ~ 18, 2026, Sydney, Australia

Scope & Topics

5th International Conference on Electrical Engineering (ELEE 2026) aims to bring together researchers and practitioners from academia and industry to focus on recent systems and techniques in the broad field of Electrical Engineering. Original research papers, state-of-the-art reviews are invited for publication in all areas of Electrical Engineering.

Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in the following areas, but are not limited to these topics only.

Topics of interest include, but are not limited to, the following



  • Advanced Power Systems
  • AI‑Driven Grid Stability and Inverter‑Based Resources
  • Smart Grid Resilience and Stability
  • Distributed Energy Resources and Microgrids
  • Energy Storage Systems and Battery Management
  • High Voltage Engineering
  • Electric Vehicle Systems and Charging Infrastructure
  • POW Transient Measurement
  • Lightning‑Induced Effects on Power and Optical Systems
  • Wide‑Bandgap Power Devices (GaN/SiC)
  • Advanced Converter Topologies
  • Electric Drives and Motor Control
  • AI‑Optimized Thermoelectric Generators
  • Semiconductor Devices and Novel Materials
  • Black Phosphorus and Stark‑Effect Tunable Circuits
  • Nano Devices and Integrated Nano Systems
  • VLSI, SoC and ASIC Design
  • Chiplet Architectures and 3D IC Integration
  • Microelectronic Technologies, CAD and EDA Tools
  • AI‑Accelerated Semiconductor Manufacturing
  • Silicon Photonics and Integrated Photonic Circuits
  • Analog, Mixed‑Signal and RF IC Design
  • Applied Electromagnetics
  • RF, Microwave and mmWave Engineering
  • THz Devices and Communication Systems
  • Electromagnetic Compatibility and Interference
  • 6G, Beyond‑5G and Holographic MIMO
  • Reconfigurable Intelligent Surfaces (RIS)
  • ISAC — Integrated Sensing and Communication
  • AI‑Optimized Constellation Shaping
  • Optical Networks and Coherent Communication
  • LEO Satellite Systems and Space Electronics
  • Remote Sensing and Earth Observation
  • Quantum Communication for Space and 6G
  • Advanced Control Systems
  • Autonomous Systems and Intelligent Control
  • Robotics, UAVs and Swarm Systems
  • Neuromorphic Tactile Sensing and Artificial Skin
  • Cyber‑Physical Systems and Digital Twins
  • Real‑Time and Safety‑Critical Systems
  • Digital Signal Processing
  • AI‑Driven Signal Processing
  • Image Processing, Computer Vision and Multimedia
  • Biomedical Imaging and Computational Diagnostics
  • Immersive Media, AR/VR and New Media Technologies
  • Smart Sensors, MEMS and Wearable Electronics
  • Measurements, Instrumentation and Metrology
  • Biomedical Instrumentation and Health Monitoring
  • Camera‑Based Biomedical Sensing
  • Bioinformatics and Computational Biology
  • Quantum Sensing and Precision Measurement
  • AI Hardware, Neuromorphic Computing and In‑Memory Computing
  • Network Security, Cybersecurity and Cryptography
  • Hardware Security and Side‑Channel Protection
  • Software Engineering and Real‑Time Computing
  • Edge, Cloud and Distributed Computing
  • Federated Learning for Smart Grids and IoT
  • System Modeling and Multi‑Physics Simulation
  • Digital Twins for Electrical Systems
  • Hybrid Optimization (Physics + ML)
  • Optimization Techniques and Metaheuristics
  • Complex Systems, Multi‑Agent Systems and Hybrid Dynamics
  • Advanced Functional Materials
  • 2D Materials and Heterostructures
  • Glass‑Based Optical Data Storage
  • Energy Harvesting and Wireless Power Transfer
  • AI for Scientific Discovery
  • Electronics for Sustainability
  • Human‑Machine Interaction and Cognitive Systems
  • Smart Cities and Intelligent Infrastructure

Paper Submission

Authors are invited to submit papers through the conference Submission System by September 05, 2026. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by Electrical and Electronics Engineering: An International Journal (ELELIJ) series (Confirmed).

Selected papers from ELEE 2026, after further revisions, will be published in the special issue of the following journals.

Important Dates

Submission Deadline: September 05, 2026
Authors Notification: September 29, 2026
Final Manuscript Due: October 06, 2026

Co - Located Event

***** The invited talk proposals can be submitted to elee@asoft2026.org

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