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EIECT 2026 : IEEE 2026 6th International Conference on Electronic Information Engineering and Computer Technology | |||||||||||||
| Link: https://ais.cn/u/Mjuiii | |||||||||||||
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Call For Papers | |||||||||||||
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IEEE 2026 6th International Conference on Electronic Information Engineering and Computer Technology (EIECT 2026) will be held in Beijing, China, from September 4-6, 2026.
๐๐ผ๐ป๐ณ๐ฒ๐ฟ๐ฒ๐ป๐ฐ๐ฒ ๐ช๐ฒ๐ฏ๐๐ถ๐๐ฒ: https://ais.cn/u/Mjuiii ---๐๐ฎ๐น๐น ๐ณ๐ผ๐ฟ ๐ฝ๐ฎ๐ฝ๐ฒ๐ฟ๐--- The topics of interest for submission include, but are not limited to: Track 1: Electronic Information Engineering โ Communication and Wireless Technologies 6G Frontier Communications Future Cellular Networks Terahertz Communications Satellite-Integrated Communications Internet of Vehicles (IoV) Communications ...... โ Network Architectures and Protocol Technologies Next-Generation Internet Software-Defined Networking (SDN) Network Function Virtualization (NFV) Data Center Networks Cloud-Edge-End Collaboration Industrial Internet of Things (IIoT) Networks Smart City Networks ...... โ Signal Processing and Intelligent Sensing Intelligent Signal Processing Multi-Modal Fusion Sensing Radar Signal Recognition Communication Signal Detection Intelligent Image Coding ...... Track 2: Computer Technology โ Artificial Intelligence and Large Models Artificial Intelligence for Communications (AI4Comm) AI Theory Reinforcement Learning Federated Learning Trustworthy and Secure AI ...... โ Computer Technologies Intelligent Computing Architecture High-Performance Computing (HPC) Heterogeneous Computing Architecture Distributed Systems Cloud-Native Technology ...... โ Data Intelligence and Application Systems Data Mining Knowledge Graph Intelligent Recommendation Systems Privacy-Preserving Computation Intelligent Internet of Things (IIoT) ...... Track 3: Electronics and Integrated Circuits โ Integrated Circuit Design and Manufacturing Integrated Circuit Design Low-Power IC Advanced Process Technology System-on-Chip (SoC) 3D Packaging Technology โ Semiconductor Devices and Materials Semiconductor Materials Power Electronic Devices Optoelectronics and Integrated Photonics Nanoelectronic Devices Quantum Devices โ Embedded and Electronic Systems Reconfigurable Computing Embedded Systems Sensors Intelligent Hardware Systems Electronic Testing and Measurement ---๐๐ฎ๐น๐น ๐๐ผ๐ฟ ๐ฆ๐ฝ๐ฒ๐ฐ๐ถ๐ฎ๐น ๐ฆ๐ฒ๐๐๐ถ๐ผ๐ป--- Special Session 1: Emerging Wireless Technologies for AI-native 6G Special Session 2: Wireless Intelligent System Twins Alliance for 6G and Beyond Special Session 3: Cutting-Edge Technologies for Next-Generation Satellite-Air-Ground Integrated Networks Special Session 4: Agentic AI-Native Communications and Networking: Architecture, Protocols, and Applications Special Session 5: Al-driven Models for Wireless Communication Technologies Special Session 6: Wireless Propagation for Emerging Applications of Integrated Sensing and Communication Special Session 7: AI-Driven Wireless Propagation and Channel Modeling Special Session 8: Next-Generation Intelligent Communications and Network Optimization Special Session 9: Green and Energy-Efficient AI-Native Wireless Systems Special Session 10: Intelligent Optical Networking Technologies for AI-Driven Data Centers ---๐๐ฒ๐๐ป๐ผ๐๐ฒ ๐ฆ๐ฝ๐ฒ๐ฎ๐ธ๐ฒ๐ฟ๐--- Prof. Weihua Zhuang,Fellow of the Canadian Academy of Engineering, IEEE Fellow,University of Waterloo, Canada Prof. Markus Rupp,IEEE Fellow,Technische Universitรคt Wien, Austria Prof. Yan Zhang,IEEE Fellow,University of Electronic Science and Technology of China, China Prof. Shiwen Mao,IEEE Fellow,Auburn University, USA Prof. Tian Hong Loh,IEEE Fellow,National Physical Laboratory, U.K. ---๐๐ป๐๐ถ๐๐ฒ๐ฑ ๐ฆ๐ฝ๐ฒ๐ฎ๐ธ๐ฒ๐ฟ๐--- Prof. Nikos C. Sagias,University of Peloponnese, Greece Dr. Philipp Svoboda,Technische Universitรคt Wien, Austria Assoc. Prof. Xingqi Zhang,University of Alberta, Canada Prof. Yang Wang,Chongqing University of Posts and Telecommunications, China Prof. Vladimir Poulkov,Technical University of Sofia, Bulgaria ---๐ฃ๐๐ฏ๐น๐ถ๐ฐ๐ฎ๐๐ถ๐ผ๐ป--- All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in IEEE (ISBN: 979-8-3195-3853-6), and submitted to EI Compendex, Scopus and Inspec for indexing. ---๐๐บ๐ฝ๐ผ๐ฟ๐๐ฎ๐ป๐ ๐๐ฎ๐๐ฒ๐--- Full Paper Submission Date: July 15, 2026 Camera Ready Papers: August 01, 2026 Registration Deadline: August 01, 2026 Conference Dates: September 4-6, 2026 --- ๐ฃ๐ฎ๐ฝ๐ฒ๐ฟ ๐ฆ๐๐ฏ๐บ๐ถ๐๐๐ถ๐ผ๐ป--- Please send the full paper(word+pdf) to Submission System: https://ais.cn/u/Mjuiii |
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