10th Expert Evaluation & Control of Compound Semiconductor Materials & Technologies (Exmatec)
May 19-21 2010
Darmstadt/Seeheim, Germany

Important dates:

March 12, 2010:
Short or Long (preferred) Abstract submission deadline
March 23, 2010: Notification of acceptance and opening of registration
April 6, 2010: Long Abstract submission deadline
April 16, 2010: Deadline for early registration and Confirmation of participation


EXMATEC 2010 is the continuation of successful, biannual meetings, previously held in Lyon, Parma, Freiburg, Cardiff, Heraklion, Budapest, Cadiz and Lodz. Contributions fall within the scope of EXMATEC as long as they treat issues of material fabrication, characterization and processing of compound semiconductors. Work on devices are also appropriate in this context. The central topics are development, improvement and application of new and advanced methods in the fabrication and evaluation of compound semiconductor materials and structures to develop understanding of the interrelationship between structural, electrical and other material properties and device characteristics, such as performance, reliability, reproducibility, lifetime, yield, etc. The conference topics apply to all compound semiconductor materials, related structures and processing. Exmatec returns this time to Germany and will take place in Darmstadt/Seeheim, Germany at Lufthansa’s New Conference Center located in the beautiful area of Bergstrasse. Despite of the European character of the workshop series, interested people from all over the world are invited to attend.

Join us in the 10th EXMATEC

The 34th Workshop on Compound Semiconductor Device Technology and Integrated Circuits held in Europe (WOCSDICE 2010) will be held in Darmstadt/Seeheim (the same location where EXMATEC will be held) from May 17 – 19, 2010. The two events complement each other covering a wide aspect of material and device considerations. Delegates are encouraged to participate in both events and take advantage of the very stimulating discussions and presentations planned on materials and devices and extending to electronic and optoelectronic circuits and applications.

Workshop Topics

* Substrates, bulk and surface properties, annealing, post growth treatment, growth control and assessment
* Epi-layers, ion implantation, wafer bonding, band gap engineering, growth control and assessment, role of buffer layers, selective deposition, hydrogenation, etc.
* Control of interfaces, surface structure, substrate pre-processing, vertical structures, lattice mismatch.
* Narrow and intermediate gap III-V, II-VI based compound materials and devices.
* Wide gap IV-IV, III-V and II-VI, Si-Ge and similar materials and devices.
* Quantum dots, low dimensional structures, other nanostructures.
* Fabrication, modelling and evaluation of compound microelectronic mechanisms.
* Reliability, physics of failure and characterization of degradation mechanisms.
* Monitoring, characterization, use of statistical process control techniques.
* Process, epitaxy, issues, intermediate products and fully processed devices.
* Instrumentation, standardization, innovative and improved characterization techniques.