posted by user: iafor_conferences || 3142 views || tracked by 1 users: [display]

AURS 2021 : The 6th Asian Undergraduate Research Symposium (AURS2021)

FacebookTwitterLinkedInGoogle

Link: https://aurs.iafor.org/
 
When Nov 27, 2021 - Nov 27, 2021
Where Online
Submission Deadline Oct 22, 2021
Notification Due Oct 8, 2021
Final Version Due Oct 22, 2021
Categories    computer science   education   engineering   networking
 

Call For Papers

Call for Papers is now closed | Register as an Audience Member

The 6th Asian Undergraduate Research Symposium (AURS2021) will be held Online from Tokyo.

The 6th Asian Undergraduate Research Symposium (AURS2021) will be held in Tokyo, Japan. This one day event is held in English and is aimed at final year undergraduate students. AURS provides undergraduates with an exciting opportunity to present and learn from researchers and professionals from around the globe.

The day-long symposium will comprise a number of workshop activities and culminate in a poster presentation during in a special session of the The 13th Asian Conference on Education (ACE2021).

Related Resources

Research Handbook on Decision Science 2026   Call for Book Chapters: Research Handbook on Decision Science
Ei/Scopus-ITCC 2026   2026 6th International Conference on Information Technology and Cloud Computing (ITCC 2026)
ICSMR 2026   2026 the 10th International Conference on Smart Material Research (ICSMR 2026)
CNCIT 2026   2026 5th International Conference on Networks, Communications and Information Technology
IJBBR 2026   International Journal of BRIC Business Research
Ei/Scopus-CMLDS 2026   2026 3rd International Conference on Computing, Machine Learning and Data Science (CMLDS 2026)
SIGIR 2026   ACM SIGIR Conference on Research and Development in Information Retrieval,
Ei/Scopus-CEICE 2026   2026 3rd International Conference on Electrical, Information and Communication Engineering (CEICE 2026)
SESBC 2026   7th International Conference on Software Engineering, Security and Blockchain
AITIJ 2026   Advances in Interconnect Technologies: An International Journal