2027 International Conference on Advanced Semiconductor and Chip Design (ICASCD 2027)

★CONTACT US
Website: www.icascd.org
Date: December 10–12, 2027
Venue: China
Full Paper Submission: June 26, 2027
Email:
Tel:+86-28-85586839 (International)
Monday-Friday, 9:00am-12:00pm and 1:30pm-6:00pm


★Welcome to ICASCD 2027
Welcome to the 2027 International Conference on Advanced Semiconductor and Chip Design (ICASCD 2027)! We are delighted to have you join us from December 10–12, 2027.
As the semiconductor industry continues to push the boundaries of Moore's Law, advanced materials, novel device architectures, and intelligent chip design methodologies are redefining the future of electronics. ICASCD 2027 brings together leading researchers, engineers, and industry professionals from around the globe to explore cutting-edge advancements in wide-bandgap semiconductors, emerging device technologies, chip design automation, heterogeneous integration, and next-generation manufacturing processes.


★Publication Information
Registered and presented full papers will be included in the ICASCD 2027 digital conference proceedings and submitted to major citation databases (including, but not limited to Ei Compendex and Scopus) for review and indexing.


★Call for papers
Topics of Interest include but not limited to:
1. Advanced Semiconductor Materials and Manufacturing
Wide-Bandgap and Ultra-Wide-Bandgap Semiconductors (SiC, GaN, Ga₂O₃, Diamond, etc.)
2D Materials and Emerging Semiconductors (Graphene, MoS₂, etc.)
Advanced CMOS, FinFET, GAA-FET, Nanosheet/Nanowire Transistors
Beyond-CMOS and Emerging Device Architectures (TFET, Negative Capacitance FET, etc.)
Quantum Materials and Topological Materials
Semiconductor Manufacturing Processes and Process Integration
Extreme Ultraviolet (EUV) Lithography and Next-Generation Patterning Technologies

2. Chip Design, EDA, and System Integration
High-Performance and Low-Power Processor Design
System-on-Chip (SoC) and Network-on-Chip (NoC)
3D-IC and Chiplet-Based Heterogeneous Integration
AI-Driven Chip Architecture and Hardware Acceleration
Memory-Centric, In-Memory, and Near-Memory Computing Architectures
Domain-Specific Accelerators for AI, Edge, IoT, and Automotive
Analog, Mixed-Signal, and RF IC Design