|
| |||||||||||
AICSD 2027 : 2027 International Conference on AI Chips and Semiconductor Design | |||||||||||
| Link: http://www.aicsd.org | |||||||||||
| |||||||||||
Call For Papers | |||||||||||
|
2027 International Conference on AI Chips and Semiconductor Design (AICSD 2027)
★CONTACT US Website: www.aicsd.org Date: October 15–17, 2027 Venue: China Full Paper Submission: April 24, 2027 Email: info@aicsd.org Tel:+86-28-85586839 (International) Monday-Friday, 9:00am-12:00pm and 1:30pm-6:00pm ★Welcome to AICSD 2027 Taking place on October 15–17, 2027, the 2027 International Conference on AI Chips and Semiconductor Design (AICSD 2027) is a premier forum focused on driving breakthroughs in AI hardware and semiconductor innovation. The conference will convene chip architects, design engineers, researchers, and industry executives to share transformative ideas and real-world solutions shaping the next generation of intelligent computing systems. ★Publication Information Registered and presented full papers will be included in the AICSD 2027 digital conference proceedings and submitted to major citation databases (including, but not limited to Ei Compendex and Scopus) for review and indexing. ★Call for papers Topics of Interest include but not limited to: 1. AI Chip Architectures and Accelerators NPUs, TPUs, and reconfigurable AI accelerators In-memory and near-memory computing architectures 2. Design Automation, EDA, and AI-Driven IC Design AI/ML-assisted EDA for logic synthesis, placement, and routing RL-driven chip floorplanning and physical design optimization 3. Advanced Semiconductor Devices and Process Technologies Sub-3nm logic devices: GAA-FETs, CFETs, and 2D material transistors Advanced lithography (EUV, high-NA EUV) and patterning techniques 4. System-Level Integration and Software-Hardware Co-Design Chiplet-based SiP and advanced packaging (2.5D/3D) Compiler and runtime optimization for AI accelerators 5. Memory Technologies and Storage for AI Systems Emerging non-volatile memories (MRAM, ReRAM, PCM) and logic integration HBM, processing-in-memory (PIM), and memory-centric architectures 6. Emerging Paradigms, Reliability, and Security Neuromorphic computing and spiking neural network (SNN) hardware Quantum, optical, and analog AI accelerators |
|