IEEE COMCAS 2013 continues the tradition of providing a multidisciplinary forum for the exchange of ideas, research results, and industry experience in the areas of microwaves, communications, antenna, solid state circuits, electromagnetic compatibility, electron devices, radar and electronic systems engineering. It includes a technical program, industry exhibits, and invited talks by international experts in key topical areas.

The conference will take place October 21-23, 2013 in, Tel Aviv, Israel. The Intercontinental Hotel on the Mediterranean sea offers an excellent venue for networking and the candid exchange of ideas.

Regular oral presentations will be 20 min. in length; there will also be Poster sessions.
All submitted papers will be peer reviewed and assessed on key accomplishments, technical contribution, and advancement of the state-of-the-art, originality and interest to the attendees. Accepted papers will be published in the COMCAS 2013 Proceedings which will be submitted for IEEE Xplore® after the conference.

Submission of papers:

English-language manuscripts, no longer than five pages including figures and references, must be submitted using the IEEE MS Word template available at
http://www.ieee.org/conferences_events/conferences/publishing/templates.html
See author instructions at http://www.comcas.org/Authorsinstruct.aspx

Important deadlines:
Submission of manuscript: May 5, 2013
Notification of acceptance/rejection: July 1, 2013
Submission of final camera-ready paper: August 1, 2013
Early bird (lower cost) registration: August 30, 2013