2027 International Conference on Advanced Chip Design and Integrated Circuit Technology (ACDICT 2027)
★CONTACT US
Website: www.acdict.org
Date: July 23–25, 2027
Venue: China
Full Paper Submission: February 6, 2027
Email: email@acdict.org
Tel:+86-28-85586839 (International)
Monday-Friday, 9:00am-12:00pm and 1:30pm-6:00pm

★Welcome to
Welcome to the 2027 International Conference on Advanced Chip Design and Integrated Circuit Technology (ACDICT 2027)! We are delighted to have you join us from July 23–25, 2027.
As the semiconductor industry enters a new era of heterogeneous integration and AI-driven design, advanced chip architectures and integrated circuit technologies are redefining the limits of computing, connectivity, and energy efficiency. ACDICT 2027 brings together leading researchers, engineers, and industry professionals from around the globe to explore cutting-edge advancements in chip design methodologies, emerging semiconductor devices, manufacturing technologies, and system-level integration.

★Publication Information
Registered and presented full papers will be included in the ACDICT 2027 digital conference proceedings and submitted to major citation databases (including, but not limited to Ei Compendex and Scopus) for review and indexing.


★Call for papers
Topics of Interest include but not limited to:
1. Advanced Chip Design and System Integration
AI-Driven Chip Architecture and Hardware Acceleration
High-Performance and Low-Power Processor Design
System-on-Chip (SoC), Network-on-Chip (NoC), and Multi-Chip Modules
3D-IC and Chiplet-Based Heterogeneous Integration
Memory-Centric, Near-Memory, and In-Memory Computing
Approximate, Stochastic, and Brain-Inspired Computing

2. IC Manufacturing, Emerging Devices, and Reliability
Advanced CMOS and Beyond-CMOS Device Technologies
FinFET, GAA-FET, and Nanosheet/Nanowire Transistors
Wide-Bandgap Semiconductor Materials and Devices (SiC, GaN, Diamond, etc.)
Emerging Memory Technologies (RRAM, MRAM, PCM, FeRAM, etc.)
Semiconductor Manufacturing Processes and Process Optimization
Yield Enhancement, Defect-Tolerant Design, and Failure Analysis