We are soliciting papers from authors around the world on all aspects of semiconductor technology and manufacturing, including semiconductor Frond-End-of-the-Line (FEOL), Back-End-of-the-Line (BEOL), packaging, silicon materials as well as emerging semiconductor and PV technologies.

Symposium I: Design and Device Engineering

Symposium II: Metrology, Reliability and Testing

Symposium III: Materials and Process Integration for Device and Interconnection

Symposium IV: Lithography and Patterning

Symposium V: CMP and Post-CMP Cleaning

Symposium VI: Thin Film, Etch & Plating

Symposium VII: Packaging and Assembly

Symposium VIII: Emerging Semiconductor Technologies

Symposium IX: Silicon Technology for Electronic and Photovoltaic Applications

CSTIC is intended to be the largest annual international conference on semiconductor technology and manufacturing in China. It aims to provide a platform for executives, managers, engineers and researchers to exchange the latest developments in semiconductor technology and manufacturing. It also offers an opportunity for those who are interested in investing in the semiconductor industry in Asia, particularly in China.

Prospective authors are requested to submit an abstract of 200-500 words and a 100 word biography by Oct. 30, 2009. The abstract must clearly describe the nature, scope, content, organization, key points and significance of the proposed paper, using the templates on the website.

Presentations are to be original, non-commercial in that they focus on the technical merits of a design, a method, a structure, an integration scheme, a material or a process rather than on the individual company’s product benefits. All abstracts will be reviewed by CSTIC committees. Selected speakers will be notified no later than Nov. 20, 2009.

Manuscripts of three to six pages including diagrams, figures, and photographs, are to be submitted electronically via the ECS Transaction website. The deadline for manuscript submittal is Jan. 10, 2010. English oral presentation materials are required by Feb. 10, 2010. Accepted papers for publication in conference proceedings are subject to co-copyright with ECS and SEMI, who reserves the right to republish, re-sell, and display submitted material in whole or in part.

SEMI ECS Student & Engineer Award (SESEA Award) will be presented during the conference to recognize outstanding scientific and/or engineering work in fundamental or applied semiconductor industrial field by a student or young engineer in the world, particularly in China. The nominee must be a graduate student or young scientist or engineer who has contributed an accumulation of outstanding theoretical and/or experimental work in the fields of semiconductor. The age is generally younger than 35. Besides technical paper, the nominator will submit to the Award Committee documentation of the nominee’s accomplishments including a list of publications, patents, professional and educational experiences before Jan. 30, 2010.